Abstract:Copper oxide was synthesis by hydrothermal method using copper nano powder (30nm) and deionized water on quartz substrate. At temperature 100 °C, different experimental time ranging from (24–72 h). Different copper oxide phase was presented in X-Ray diffraction analyzer, the crystal size increased as the reaction time increased as it calculated using scherrer equation to be (21.1–32.03 nm), and Williamson Hall plot to be (40.3–87.7 nm). Also, Raman spectroscopy show different copper phase and the highest intensity peak at 220 cm −1 , due to the cuprous oxide in all sample used to distinct chemical fingerprint for a particular molecule or material. Many of metal oxide bond was study by FTIR to clarify the compositional and chemical properties of the prepared samples. Optical characteristic with different absorption peaks of thin film show decrease in the band gap from (2.8–2.4 eV) as the reaction time increase. PL measurement used also to determine the band gap energy of the prepared thin film which found to be agreement with UV–Vis, and the band gap value is (2.7, 2.6, 2.5, 2.3, and 2.3 eV), respectively. Increasing in the surface roughness from (3.637–25.16 nm), and in the root mean square from (5–29.39 nm), and grain size with increasing the reaction time from (24–72 h), respectively, was measured by using AFM technique. Different morphologies were showed with increasing the reaction time, spherical and truncated octahedral in different type was obtained by field emission-scanning electron microscope (FE-SEM) as the particles subject to transformation caused the preparing agglomerated crystallites. The electrical characteristic was analysis use DC measurement to measure the activation energy which varied with reaction time. The figure of merit analysis shows that the copper oxidation state to obtain cuprous oxide (Cu 2 O) is mainly obtained at the 48 h-reaction time. The used of copper nano powder in hydrothermal method without adding any auxiliary material the main aim of this research.

Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

The Convenient Preparation of Porous CuO Via Copper Oxalate Precursor

Selective determination of cuprous ion in copper dissolving solution based on bathocuproine-modified expanded graphite electrode

Preparation of Micron Size Cuprous Oxide Powder from Acidic CuCl2 Etchant Waste Solution

A novel wet-chemical method of preparing highly monodispersed Cu2O nanoparticles

Properties and Microstructure Regulation of Electrodeposited Ultra-thin Copper Foil in a Simple Additive System

Effect of pH on the electrodeposition nucleation and growth mechanism of cuprous oxide

Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath

Deposition time effect on copper oxide nano structures, an analysis study using chemical method

Roles and influencing mechanisms of Fe2+ and Lix984 in copper electrodeposition

Facile synthesis of cupric hydroxide and cupric oxide on copper foil for potential electrochemical applications

Cuprous Oxide Thin Film Directly Electrodeposited from a Simple Copper Salt on Conductive Electrode for Efficient Oxygen Evolution Reaction

Preparation and Application of Ultrafine Copper Powder

Microstructure and Properties of Porous Copper Foils with High Specific Surface Area Prepared by Electrodeposition

Production of Fine Copper Powder Based on the Theory on Preparation of Monodispersed Particles. Production of fine copper powder by disproportionation reaction of cuprous sulfate solution (2nd Report).

Obtaining nanoparticles of Cu2O by means of a pulsed discharge of CH3CH2OH-N2

Bisphenol A Polyoxyethylene Ether Sodium Sulfate as a New Leveler for Electrodeposition of Copper

Controlled synthesis, structural, morphological and electrochemical study of Cu(OH)2@Cu flexible thin film electrodes prepared via aqueous–non-aqueous routes

[Electrochemical deposition of copper by using ionic liquids as additive and its surface-enhanced Raman scatting effect]

Dynamics of bulk and surface oxide evolution in copper foams for electrochemical CO2 reduction

Interactive Effects of Additives and Electrolyte Flow Rate on the Microstructure of Electrodeposited Copper Foils