Abstract:The ever-increasing demand for higher I/O counts on chip requires the finer pitches to improve the performance, cost effectiveness and higher yield. The conventional under bump metallization (UBM) technology may not guarantee the required performance due to higher current density and diffusivity nowadays. In order to overcome these challenges, a UBM with higher strength and resistance to diffusion, better thermal and microstructural properties are required. Recently, nano reinforced Ni-P alloy has been identified as potential approach. Especially, the addition of Carbon nanotube (CNT) was expected to provide strengthening to the resulting UBM layers. CNTs have exceptional and attractive thermal, electrical, and mechanical properties, and are believed to be ideal material for fabricating composites. However, due to the large surface volume ratio, CNTs have strong tendency to agglomerate, which results in clusters. CNT clusters may lead to void formation and further cracking. Therefore, it is of great importance to figure out methods to disperse and incorporate CNTs into Ni-P UBM. In order to disperse carbon nano-tubes in electroless Ni-P coatings, two approaches were employed. Chemical modification, which includes acid oxidation treatment and surfactant treatment were conducted to disperse CNT clusters. Meanwhile, magnetic stirring and ultrasonic agitation were also employed to prepare the CNT/Ni-P composite coatings with CNTs homogeneously embedded. SEM and TEM were used to observe the dispersion after adopting the aforementioned treatment as well as the surface morphology of the deposited layers. It was verified that the dispersion can be significantly improved after proper treatment process, and surface of the CNT/Ni-P was quite smooth; CNTs were equably dispersed throughout the matrix. In addition, the interfacial bonding between CNTs and Ni-P coatings was good and firm. In these cases, an understanding of the effects of the acid oxidation, surfactant dispersant- magnetic stirring and ultrasonic agitation on CNT dispersion in both solution and deposited layer were ascertained.

The Influence of CTAB Surfactant on the Dispersion of Al<sub>2</sub>O<sub>3</sub> Particles and Deposition Rate of Electroless Ni-P-Al<sub>2</sub>O<sub>3</sub> Coatings

Electrophoretic Deposition of Nacre Coatings on Titanium Substrates

Fabrication and performance of Ni-Co-P/Si3N4 electroplated composite coatings on al-si alloys

Effect of Surfactants on the Electrodeposition of Cu-TiO2 Composite Coatings Prepared by Jet Electrodeposition

Corrosion Behavior of Ni-P-Nano-Al2o3 Composite Coating in the Presence of Anionic and Cationic Surfactants

Composite Electroless Nickel-nano Al2O3 Coatings on Steel Substrate

Influence of a Zwitterionic Surfactant on the Surface Properties of Electroless Ni–P Coating on Mild Steel

Effect of Nitrogen Protective Atmosphere on Microstructure and High Temperature Erosion Property of TiAl3 and Cr3C2 Composite Coatings

Dispersed CeO2 Nanorods with Low-Speed Mixing for Mechanical Properties Promotion of PTA Steel Coatings

Effect of nano-Al 2 O 3 particle addition on Co–P–xAl 2 O 3 nanocomposite plating electroplated on X65 steel

Electroless deposition of ternary Ni–P alloy coatings containing tungsten or nano-scattered alumina composite on steel

Effects of Surfactants in an Electroless Nickel-Plating Bath on the Properties of Ni−P Alloy Deposits

Technology for Ni-Al2O3 Composite Coating and Its Properties

Effective method to disperse and incorporate Carbon nanotubes in electroless Ni-P deposits

Influence of Pt Particles on the Porosity of Al2O3 Coating Prepared by Cathode Plasma Electrolytic Deposition

Introduction of heavy micro titanium carbide particles into Zn‐Ni coatings on steel during in‐situ brush electroplating

Effects of Ligands on Electroless Ni–P Alloy Plating from Alkaline Citrate–ammonia Solution

Effect of Al2O3, ZnO and TiO2 Atomic Layer Deposition Grown Thin Films on the Electrochemical and Mechanical Properties of Sputtered Al-Zr Coating

Exploring the impact of a cetyltrimethylammonium bromide surfactant on the electrochemical performance of tungsten oxide thin films

Development of Uniform and Porous Al Coatings on FeCrAl Substrate by Electrophoretic Deposition

The Performance of Zn-Ni Alloy Coating Electrodeposited from Stabilized Bath

The Influence of CTAB Surfactant on the Dispersion of Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; Particles and Deposition Rate of Electroless Ni-P-Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; Coatings