Blistering Behavior and Deuterium Retention in Tungsten Vanadium Alloys Exposed to Deuterium Plasma in the Linear Plasma Device STEP
Jun Wang,Long Cheng,Yue Yuan,Shao-Yang Qin,Kameel Arshad,Guo,Zheng Wang,Zhang-Jian Zhou,Guang-Hong Lu
DOI: https://doi.org/10.1016/j.jnucmat.2018.01.006
IF: 3.555
2018-01-01
Journal of Nuclear Materials
Abstract:The behavior of tungsten-vanadium (W-V) alloys fabricated by powder metallurgy as a plasma facing material has been studied. W-V alloys with different vanadium concentrations (5 and 10 wt %) manufactured by hot pressing (HP) were exposed to deuterium plasma (flux -4.6 x 10(21) m(-2)s(-1), fluence similar to 5.6 x 10(25) m(-2), ion energy similar to 60 eV, target temperature similar to 450 K) in the linear plasma device STEP at Beihang University. Three typical grains are observed on HP sintered W-V alloys and exhibit a significant effect on its performance under deuterium plasma irradiation. Surface blistering only occurs at Wenriched grains and is significantly mitigated in W-V alloys, especially in W-10 V, blistering is completely suppressed. On the other hand, deuterium retention dramatically increases in the W-V alloys due to vanadium addition. The deuterium retention in W-5 wt. % V is about 6.2 times more than that in rolled pure W, and this factor further increases to 6.9 when the V concentration rises to 10 wt %. We ascribe these phenomena to the changes of microstructures and components caused by vanadium addition. (C) 2018 Elsevier B.V. All rights reserved.