Abstract:Cyclic deformation behaviour of a [(4) over bar 15 20]-[18 (2) over bar 7] copper bicrystal with a tilting Sigma = 19b grain boundary (GB) was investigated in the axial plastic strain range 1.5 x 10(-4) -2.13 x 10(-3) at room temperature in air. The primary slip planes (111) within the G(1)[(4) over bar 15 20] and G(2)[18 (2) over bar7] grains in the bicrystal were designed to be coplanar in order to reveal the interaction of slip bands with the GB. The results show that the cyclic stress-strain curve of the bicrystal displays a plateau region with axial saturation stresses of 61.6-63.5 MPa over the applied strain range. This result is similar to that for a single-slip-oriented copper single crystal, indicating that the GB has little effect on the saturation stress. After cyclic deformation, the surface morphology of the bicrystal exhibits the following features. Firstly, only the primary slip system was activated in both grains. Secondly, the primary slip bands on the four surfaces of the two grains show a good one-to-one relationship across the GB, indicating that surface slip bands can transfer through it. Thirdly, secondary slip systems were not activated, even in the vicinity of the GB. Dislocation patterns of the bicrystal were observed by the electron channelling contrast technique. The two-phase structure of persistent slip bands (PSBs) and matrix (or veins) formed in both grains. The ladder-like PSBs were observed to transfer through the GB continuously on one surface of the bicrystal but piled-up at the GB on the other surface, showing a discontinuous dislocation distribution next to the GB. Several kinds of interaction between dislocations and the GB were observed on the common slip plane. The cyclic stress-strain response and the interactions between dislocations, PSBs and the GB are discussed.

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Molecular Dynamics Study on Tensile Strength of Twist Grain Boundary Structures under Uniaxial Tension in Copper

Tensile Deformation Behavior of Copper Bicrystal with Perpendicular Grain Boundary

Molecular Dynamics Study on the Atomic Mechanisms of Coupling Motion of [0 0 1] Symmetric Tilt Grain Boundaries in Copper Bicrystal

Atomistic Simulations of Tension Properties for Bi-Crystal Copper with Twist Grain Boundary

Influences of Symmetric Tilt Grain Boundary on the Stretching Deformation Behaviors of Cu Bicrystals

Shock Deformation and Spallation of Cu Bicrystals with (1 1 1) Twist Grain Boundaries

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The Shear Response of Copper Bicrystals with Σ11 Symmetric and Asymmetric Tilt Grain Boundaries by Molecular Dynamics Simulation.

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Molecular Dynamics Simulation on Σ5 Grain Boundaries of Copper Bicrystal under Tensile and Shear Deformation

Molecular dynamics simulation of grain boundary geometry on crack propagation of bi-crystal aluminum

Shock Response of Copper Bicrystals with a ∑3 Asymmetric Tilt Grain Boundary

A Close Observation on the Deformation Behavior of Bicrystal Copper under Tensile Loading

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Molecular Dynamical Investigation on Plastic Behavior of Cu(100) Twist-Grain Boundary under Uniaxial Tension

The impact of structural units on the dislocation nucleation of bi-crystal copper grain boundary

Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary

Lattice Distortion and Thermal Stability of Nano-Crystalline Copper

Dislocation Nucleation from Symmetric Tilt Grain Boundaries in Body-Centered Cubic Vanadium