Thermoelectric Property Studies on Cu‐Doped N‐type CuxBi2Te2.7Se0.3 Nanocomposites
Wei-Shu Liu,Qinyong Zhang,Yucheng Lan,Shuo Chen,Xiao Yan,Qian Zhang,Hui Wang,Dezhi Wang,Gang Chen,Zhifeng Ren
DOI: https://doi.org/10.1002/aenm.201100149
IF: 27.8
2011-01-01
Advanced Energy Materials
Abstract:Combining high energy ball‐milling and hot‐pressing, significant enhancements of the thermoelectric figure‐of‐merit (ZT) have been reported for p‐type Bi0.4Sb1.6Te3 nanocomposites. However, applying the same technique to n‐type Bi2Te2.7Se0.3 showed no improvement on ZT values, due to the anisotropic nature of the thermoelectric properties of n‐type Bi2Te2.7Se0.3. Even though texturing was effective in improving peak ZT of Bi2Te2.7Se0.3 from 0.85 to 1.04, reproducibility from batch to batch remains unsatisfactory. Here, we show that good reproducibility can be achieved by introducing an optimal concentration of 0.01 copper (Cu) per Bi2Te2.7Se0.3 to make Cu0.01Bi2Te2.7Se0.3 samples. A peak ZT value of 0.99 was achieved in Cu0.01Bi2Te2.7Se0.3 samples without texturing. With texturing by re‐pressing, the peak ZT was increased to 1.06. Aging in air for over 5 months did not deteriorate but further improved the peak ZT to 1.10. The mechanism by which copper improves the reproducibility, enhances the carrier mobility, and reduces the lattice thermal conductivity is also discussed.