Back Cover: Stabilization of Copper Catalysts for Liquid‐Phase Reactions by Atomic Layer Deposition (angew. Chem. Int. Ed. 51/2013)

Brandon J. O'Neill,David H. K. Jackson,Anthony J. Crisci,Carrie A. Farberow,Fengyuan Shi,Ana C. Alba‐Rubio,Junling Lu,Paul J. Dietrich,Xiangkui Gu,Christopher L. Marshall,Peter C. Stair,Jeffrey W. Elam,Jeffrey T. Miller,Fabio H. Ribeiro,Paul M. Voyles,Jeffrey Greeley,Manos Mavrikakis,Susannah L. Scott,Thomas F. Kuech,James A. Dumesic
DOI: https://doi.org/10.1002/anie.201309934
2013-01-01
Angewandte Chemie
Abstract:Deactivation of heterogeneous catalysts is an important issue in liquid-phase catalytic processes and for the utilization of base metal catalysts, such as copper. In their Communication on page 13808 ff., J. A. Dumesic et al. show that atomic layer deposition can be used to build a protective coating around metallic nanoparticles, thereby preventing irreversible catalyst deactivation during liquid-phase catalytic processing.
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