Stabilization of Copper Catalysts for Liquid‐Phase Reactions by Atomic Layer Deposition

Brandon J. O'Neill,David H. K. Jackson,Anthony J. Crisci,Carrie A. Farberow,Fengyuan Shi,Ana C. Alba-Rubio,Junling Lu,Paul J. Dietrich,Xiangkui Gu,Christopher L. Marshall,Peter C. Stair,Jeffrey W. Elam,Jeffrey T. Miller,Fabio H. Ribeiro,Paul M. Voyles,Jeffrey Greeley,Manos Mavrikakis,Susannah L. Scott,Thomas F. Kuech,James A. Dumesic
DOI: https://doi.org/10.1002/anie.201308245
2013-01-01
Angewandte Chemie
Abstract:AbstractAtomic layer deposition (ALD) of an alumina overcoat can stabilize a base metal catalyst (e.g., copper) for liquid‐phase catalytic reactions (e.g., hydrogenation of biomass‐derived furfural in alcoholic solvents or water), thereby eliminating the deactivation of conventional catalysts by sintering and leaching. This method of catalyst stabilization alleviates the need to employ precious metals (e.g., platinum) in liquid‐phase catalytic processing. The alumina overcoat initially covers the catalyst surface completely. By using solid state NMR spectroscopy, X‐ray diffraction, and electron microscopy, it was shown that high temperature treatment opens porosity in the overcoat by forming crystallites of γ‐Al2O3. Infrared spectroscopic measurements and scanning tunneling microscopy studies of trimethylaluminum ALD on copper show that the remarkable stability imparted to the nanoparticles arises from selective armoring of under‐coordinated copper atoms on the nanoparticle surface.
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