Atomic Layer Deposition of Cu Electrocatalysts on Gas Diffusion Electrodes for CO 2 Reduction

Julia D. Lenef,Si Young Lee,Kalyn M. Fuelling,Kevin E. Rivera Cruz,Aditya Prajapati,Daniel O. Delgado Cornejo,Tae H. Cho,Kai Sun,Eugenio Alvarado,Timothy S. Arthur,Charles A. Roberts,Christopher Hahn,Charles C. L. McCrory,Neil P. Dasgupta
DOI: https://doi.org/10.1021/acs.nanolett.3c02917
IF: 10.8
2023-11-22
Nano Letters
Abstract:Electrochemical reduction of CO(2) using Cu catalysts enables the synthesis of C(2+) products including C(2)H(4) and C(2)H(5)OH. In this study, Cu catalysts were fabricated using plasma-enhanced atomic layer deposition (PEALD), achieving conformal deposition of catalysts throughout 3-D gas diffusion electrode (GDE) substrates while maintaining tunable control of Cu nanoparticle size and areal loading. The electrochemical CO(2) reduction at the Cu surface yielded a total Faradaic efficiency (FE)...
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
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