Abstract:The considerable heat generated in electronic devices, resulting from their high-power consumption and dense component integration, underscores the importance of developing effective thermal interface materials. While composite materials are ideal for this application, the random distribution of filling materials leads to numerous interfaces, limiting improvements in thermal transfer capabilities. An effective method to improve the thermal conductivity of composites is the alignment of anisotropic fillers, such as hexagonal boron nitride (BN). In this study, the repeat blade coating method was employed to horizontally align BN within a polydimethylsiloxane (PDMS) matrix, followed by flipping and cutting to prepare BN/PDMS composites with vertically aligned BN (V-BP). The V-BP composite with 30 wt.% BN exhibited an enhanced out-of-plane thermal conductivity of up to 1.24 W/mK. Compared to the PDMS, the V-BP composite exhibited outstanding heat dissipation capacities. In addition, its low density and exceptional electrical insulation properties showcase its potential for being used in electronic devices. The impact of coating velocity on the performance of the composites was further studied through computational fluid dynamics simulation. The results showed that increasing the coating velocity enhanced the out-of-plane thermal conductivity of the V-BP composite by approximately 40% compared to those prepared at slower coating velocities. This study provides a promising approach for producing thermal interface materials on a large scale to effectively dissipate the accumulated heat in densely integrated electronic devices.

Thermal Conductivity Enhancement of Platelets Aligned Composites with Volume Fraction from 10% to 20%

Thermal Conductivity of Polymer-Based Composites with Magnetic Aligned Hexagonal Boron Nitride Platelets.

Sequential Dual Alignments Introduce Synergistic Effect on Hexagonal Boron Nitride Platelets for Superior Thermal Performance

Enhanced Thermal Transport of Hexagonal Boron Nitride Filled Polymer Composite by Magnetic Field-Assisted Alignment

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation.

Surface modification and magnetic alignment of hexagonal boron nitride nanosheets for highly thermally conductive composites

Control of alignment of h-BN in polyetherimide composite by magnetic field and enhancement of its thermal conductivity

Epoxy/h-BN Composites Based on Oriented Boron Nitride Platelets with High Thermally Conductivity for Electronic Encapsulation

The Alignment of AlN Platelets in Polymer Matrix and Its Anisotropic Thermal Properties

Thermally Conductive Polydimethylsiloxane-Based Composite with Vertically Aligned Hexagonal Boron Nitride

Thermal enhancement by constructing ordered-orienting hybrid network with modified boron nitride, graphene and carbon nanotubes in epoxy composite coatings

Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging

Ordered stacking of oriented BN in confined space to construct effective heat transfer pathways

Synergetic enhancement of thermal conductivity by constructing BN and AlN hybrid network in epoxy matrix

Magnetically assisted construction of Al 2 O 3 platelets dual network and its excellent thermal conductivity in epoxy resin composites

Magnetically Assisted Construction of Al2O3 Platelets Dual Network and Its Excellent Thermal Conductivity in Epoxy Resin Composites

Enhancement of thermal conductivity of BN-Ni/epoxy resin composites through the orientation of BN-Ni fillers by magnetic field and hot-pressing

Bi-directional High Thermal Conductive Epoxy Composites with Radially Aligned Boron Nitride Nanosheets Lamellae

Simple and Consecutive Melt Extrusion Method to Fabricate Thermally Conductive Composites with Highly Oriented Boron Nitrides

Polymer composites with enhanced thermal conductivity via oriented boron nitride and alumina hybrid fillers assisted by 3-D printing

Enhanced Through-Plane Thermal Conductivity of Boron Nitride/epoxy Composites