Magnetically assisted construction of Al 2 O 3 platelets dual network and its excellent thermal conductivity in epoxy resin composites

Fanjun Guo,Kangle Xue,Tao You,Zibo Hua,Li Liu,Jun Li,Yudong Huang

DOI: https://doi.org/10.1016/j.compositesa.2023.107988

IF: 9.463

2023-12-28

Composites Part A Applied Science and Manufacturing

Abstract:Constructing three-dimensional thermally conductive networks in polymer matrix is a key strategy to improve the thermal management performance of electronic packaging materials. However, optimizing the thermal conductivity of the composite while retaining its electrical insulation properties still requires further structural design. Herein, the heat-transferring Al 2 O 3 platelets dual network was constructed by using a simple compression moulding method combined with a magnetic alignment strategy. Al 2 O 3 @Fe 3 O 4 was used for the magnetic orientation arrangement in the vertical direction of the laminated Al 2 O 3 framework. And the obtained Al 2 O 3 /Al 2 O 3 @Fe 3 O 4 /Epoxy composites possessed satisfactory thermal conductivity. The thermal conductivity of the composites containing 34.63 vol% filler was as high as 2.30 W/mK (K‖) and 1.83 W/mK (K⊥), which were significantly higher by 945% and 732% compared to epoxy resin. In addition, the introduction of Al 2 O 3 @Fe 3 O 4 in the composite promoted isotropic thermal conductivity and provided electromagnetic shielding properties.

materials science, composites,engineering, manufacturing