Structure And Dielectric Properties Of Polyimide/Silica Nanocomposite Nanofoam Prepared By Solid-State Foaming

xiaowen li,huawei zou,pengbo liu

DOI: https://doi.org/10.1002/app.42355

IF: 3

2015-01-01

Journal of Applied Polymer Science

Abstract:In this article, polyimide (PI)/silica nanocomposite nanofoams were prepared by solid-state foaming using supercritical CO2 as foaming agent. To control the cell size and morphology of the PI/silica foam, the silica nanoparticles as nucleating agent were in situ formation from TEOS via sol-gel process, which make the silica nanoparticles homogeneously dispersed in PI matrix. The resulting PI/silica nanocomposite nanofoams were characterized by scanning electron microscopy (SEM), the image analysis system attached to the SEM and dielectric properties measurements. In PI/silica nanocomposite nanofoams, one type of novel morphology was shown that each cell contained one silica nanoparticle and many smaller holes about 20-50 nm uniformly located in the cell wall. This special structure could visually prove that the nucleation sites during foaming were formed on the surface of nucleating agents. Compared with those of neat PI foam, the cell size of PI/silica nanocomposite nanofoams was smaller and its distribution was narrower. The dielectric constant of PI/silica nanocomposite nanofoams was decreased because of the incorporation of the air voids into the PI/silica nanofoams. While the porosity of PI/silica nanocomposite nanofoam film was 0.45, the dielectric constant of the film (at 1 MHz) was reduced from 3.8 to about 2.6. Furthermore, the dielectric constant of PI/silica nanofoam films remained stable across the frequency range of 1x10(2)approximate to 1x10(7) H-Z. (c) 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015, 132, 42355.