Abstract:Laser machining by ultra-short (sub-ps) pulses at high intensity offers high precision, high throughput in terms of area or volume per unit time, and flexibility to adapt processing protocols to different materials on the same workpiece. Here, we consider the challenge of optimization for high throughput: how to use the maximum available laser power and larger focal spots for larger ablation volumes by implementing a fast scan. This implies the use of high-intensity pulses approaching ∼PW/cm2 at the threshold where tunneling ionization starts to contribute to overall ionization. A custom laser micromachining setup was developed and built to enable high speed, large-area processing, and easy system reconfiguration for different tasks. The main components include the laser, stages, scanners, control system, and software. Machining of metals such as Cu, Al, or stainless steel and fused silica surfaces at high fluence and high exposure doses at high scan speeds up to 3 m/s were tested for the fluence scaling of ablation volume, which was found to be linear. The largest material removal rate was 10 mm3/min for Cu and 20 mm3/min for Al at the maximum power 80 W (25 J/cm2 per pulse). Modified surfaces are color-classified for their appearance, which is dependent on surface roughness and chemical modification. Such color-coding can be used as a feedback parameter for industrial process control.

Uv Power Scaling of Innoslab Lasers

Recent Progresses in Innoslab Lasers and Their Harmonic Generation

High-power 355 Nm Ultraviolet Lasers Operating at Ultrahigh Repetition Rate

Applications of Innoslab Lasers with Tailored Beam Profiles

The Unique Features and Application Examples of INNOSLAB Lasers

Deep-Ultraviolet Emission from an Ingaas Semiconductor Laser

High-peak-power picosecond deep-UV laser sources

Compact Partially End-Pumped Innoslab Laser Based on Micro-Cylindrical Lens Array Homogenizer

1.9-W Flash-Lamp-Pumped Solid-State 266-Nm Ultraviolet Laser

35.1 W All-Solid-State 355 Nm Ultraviolet Laser

Stable 500 kW average power of infrared light in a finesse 35 000 enhancement cavity

Laser Machining at High ∼PW/cm2 Intensity and High Throughput

Development and Characterization of a 22 W Narrow-Linewidth 3186 Nm Ultraviolet Laser

UV-ultrashort pulsed laser ablation of fused silica

High-repetition-rate High-Beam-quality 43 W Ultraviolet Laser with Extra-Cavity Third Harmonic Generation

High Power All-Solid-state Fourth Harmonic Generation of 266 Nm at the Pulse Repetition Rate of 100 Khz

All-Solid-State DUV Light Source by Quadrupling of an Acousto-Optically Q-Switched Nd:YVO 4 Laser

39.1 μJ picosecond ultraviolet pulses at 355 nm with 1 MHz repeat rate.

391 Μj Picosecond Ultraviolet Pulses at 355 Nm with 1 MHz Repeat Rate

300 W two-stage Nd:YAG Innoslab microsecond amplifier

High-Beam-Quality All-Solid-State 355 Nm Ultraviolet Pulsed Laser Based on A Master-Oscillator Power-Amplifier System Pumped at 888 Nm