Ultraprecision grinding of TiC-based cermet hemisphere couples

Bing Guo,Qingliang Zhao,Hongliang Li

DOI: https://doi.org/10.1007/s00170-014-5913-5

IF: 3.563

2014-01-01

The International Journal of Advanced Manufacturing Technology

Abstract:In aerospace industry, TiC-based cermet hemisphere couples are widely used as dry sliding bearing and gyro due to its high resistance to wear and heat. To enhance the grinding precision, this paper presents an ultraprecision grinding technique for machining TiC-based cermet hemisphere couples. The factors affecting the form and dimension accuracy of the hemisphere couples in ultraprecision grinding were analyzed theoretically. The optimization of grinding conditions and ground surface morphology of TiC-based cermets were investigated. In addition, the subsurface damage of ground TiC-based cermet hemisphere couples was observed by focused ion beam FIB. The research results show that position errors have more significant impact on concave in grinding of hemisphere couples. The TiC-based cermet ground surface revealed a smooth surface covered by micropits, traces, and reliefs because of the special material properties, and the surface roughness could be improved by the decrease of feed rate, while the different feed rates did not influence form accuracy. Finally, TiC-based cermet hemisphere couples with 16 nm surface roughness, 0.3 μm PV form accuracy, radius deviation of less than 3 μm, and subsurface damage depth of less than 2.5 μm were obtained.