Morphology and Properties of Porous Polyimide Films Prepared Through Thermally Induced Phase Separation

Zhonglun Li,Huawei Zou,Pengbo Liu

DOI: https://doi.org/10.1039/c5ra01514f

IF: 4.036

2015-01-01

RSC Advances

Abstract:Porous polyimide (PI) synthesized from 4,4′-oxydiphthalic anhydride (ODPA) and 4,4′-diaminodiphenyl ether (ODA) monomers is a promising material with an ultralow-dielectric constant.

What problem does this paper attempt to address?

Morphology and Dielectric Property of Cellular Polyimide Films Prepared by Phase Inversion

Hui-Juan Chu,Hong-Liang Wei,Jing Zhu,Bao-Ku Zhu,You-Yi Xu

DOI: https://doi.org/10.4028/www.scientific.net/amr.557-559.704

2012-01-01

Advanced Materials Research

Abstract:In order to explore low dielectric polymeric materials, two types of cellular polyimide films with different dianhydride units were prepared by phase inversion method, and their dielectric properties were investigated. Polyimide films with various cellular structures were obtained by controlling coagulation bath compositions and temperatures. The effects of chemical structures, cellular structures on dielectric property of cellular polyimide films were studied. The results showed that all of the cellular polyimide films had lower dielectric constants than the polymer matrix. The dielectric properties were influenced dominantly by the morphologies of the films. Cellular Polyimide films filled with uniform small cellular structures behaved excellent dielectric property compared with those large-pore cellular films. These findings would provide potential application for cellular polyimide films in microelectronic devices.
Synthesis and Properties of Ultralow Dielectric Constant Porous Polyimide Films Containing Trifluoromethyl Groups

Jianwei Li,Guangcheng Zhang,Qi Zhu,Jiantong Li,Hongming Zhang,Zhanxin Jing

DOI: https://doi.org/10.1002/app.44494

IF: 3

2016-01-01

Journal of Applied Polymer Science

Abstract:ABSTRACTIn this research, a series of porous copolyimide (co‐PI) films containing trifluoromethyl group (CF3) were facilely prepared via a phase separation process. The co‐PI were synthesized by the reaction of benzophenone‐3,3′,4,4′‐tetracarboxylic dianhydride (BTDA) with two diamines of 4,4′‐diaminodiphenyl ether (ODA) and 3‐trifluoromethyl‐4,4'‐diaminodiphenyl ether (FODA) with various molar ratios. The flexible and tough porous co‐PI films with about 300 μm thickness and 8∼10 μm average diameter could be obtained by solution casting conveniently. The thermal properties of the obtained porous co‐PI films were excellent with a glass transition temperature at 270 °C ∼ 280 °C and only 5% weight loss in temperature from 530 °C to 560 °C under nitrogen atmosphere. In addition, the dielectric and hydrophobic properties of porous co‐PI films were remarkably improved owing to the presence of trifluoromethyl groups (CF3) in the polymer chains. Moreover, our synthesized porous co‐PI films also showed good mechanical properties. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 134, 44494.
Synthesis And Characterization Of Porous Polyimide Films Containing Benzimidazole Moieties

Jianwei Li,Guangcheng Zhang,Zhanxin Jing,Jiantong Li,Lisheng Zhou,Hongming Zhang

DOI: https://doi.org/10.1177/0954008317697803

IF: 1.73

2017-01-01

High Performance Polymers

Abstract:In this study, a series of porous polyimide films containing benzimidazole units were prepared through a phase separation process. The dibutyl phthalate was selected as porogen. The copolyimides were prepared by the reaction of 3,3,4,4-benzophenonetetracarboxylic dianhydride with two diamines of 2-(4-aminophenyl)-5-aminobenzimidazole (BIA) and 4,4-diaminodiphenyl ether with various molar ratios. The resultant porous polyimide films exhibit optimum cell-size distributions. The effects of BIA on morphology, mechanical, and thermal properties of the porous films were explored. It was found that as the BIA content reached up to 30 mol%, the porous copolyimide film demonstrates remarkable thermal stability and admirable mechanical properties with the glass transition temperature of 294 degrees C, 5% weight loss temperature in argon flow up to 545 degrees C, and a tensile strength of 48 MPa. The incorporation of BIA into the polyimide chains brought the highly rigid structures and strong intermolecular interactions, resulting in the enhancement in the thermal stability and the mechanical properties.
Preparation of Porous Polyimide Film with Low Didectric Constant by Nonsolvent Induced Phase Separation

Wu Peng,Li Zonglun,Yu Zhi,Liu Pengho

DOI: https://doi.org/10.16865/j.cnki.1000-7555.2018.03.023

2018-01-01

Abstract:In this paper,one kind of porous polyimide (PI) film with low dielectric constant was prepared by nonsolvent induced phase separation method.SEM observations show that the pores are homogeneously dispersed and their average pore size is between 6 μm and 28μm.With increasing of the polyamic acid (PAA) concentration and enhancing of the temperature of coagulation bath,the porosity and average pore size of the porous PI films are increased.Dielectric property analysis shows the dielectric constant of the porous PI films is obviously decreased.When the porosity of the porous film is 80％,its dielectric constant (1 MHz) is 1.81.Tensile test shows that the tensile strength and modulus of the porous PI films are decreased with the increase of porosity,while the elongation at break of the films is increased.
Mesoporous polyetherimide thin films via hydrolysis of polylactide-b-polyetherimide-b-polylactide

Dong Guo,Jocelyn Riet,Assad U. Khan,Yichen Guo,Zhen Xu,Tianyu Liu,Guoliang Liu

DOI: https://doi.org/10.1039/d1py00601k

IF: 4.6

2021-01-01

Polymer Chemistry

Abstract:Mesoporous polyetherimides are important high-performance polymers. Conventional strategies to prepare porous polyetherimides, and polyimide in general, are based on covalent organic framework or thermolysis of sacrificial polymers. The former produces micropores due to intrinsically crosslinked microstructures, and the latter results in macropores because of a blowing effect by the sacrificial polymers. The preparation of mesopores remains a challenge. Here we have prepared mesoporous polyetherimide films by hydrolyzing polylactide-b-polyetherimide-b-polylactide (AIA). Controlled by molecular weight and volume fraction of polylactide in AIA, the porous films exhibit an average pore width of 24 nm. The mesoporous polyetherimide films exhibit a storage modulus of ∼1 GPa at ambient temperatures. This work advances the chemistry of high-performance polymers and provides an alternative strategy to prepare mesoporous polymers, enabling potential use as high-performance membranes for separation, purification, and electrochemistry.
2021 pioneering investigator issue: mesoporous polyetherimide thin films via hydrolysis of polylactide-b-polyetherimide-b-polylactide

Dong Guo,Jocelyn Riet,Assad Khan,Yichen Guo,Zhen Xu,Tianyu Liu,Guoliang Liu

DOI: https://doi.org/10.1039/d1py00601k

IF: 4.6

2021-01-01

Polymer Chemistry

Abstract:Mesoporous polyetherimides are important high-performance polymers. Conventional strategies to prepare porous polyetherimides, and polyimide in general, are based on covalent organic framework or thermolysis of sacrificial polymers. The former produces micropores due to intrinsically crosslinked microstructures, and the latter results in macropores because of a blowing effect by the sacrificial polymers. The preparation of mesopores remains a challenge. Here we have prepared mesoporous polyetherimide films by hydrolyzing polylactide-b-polyetherimide-b-polylactide (AIA). Controlled by molecular weight and volume fraction of polylactide in AIA, the porous films exhibit an average pore width of 24 nm. The mesoporous polyetherimide films exhibit a storage modulus of similar to 1 GPa at ambient temperatures. This work advances the chemistry of high-performance polymers and provides an alternative strategy to prepare mesoporous polymers, enabling potential use as high-performance membranes for separation, purification, and electrochemistry.
Effect of Polymer Structure on the Morphologies and Dielectric Properties of Nanoporous Polyimide Films

Fengzhu Lv,Leipeng Liu,Yihe Zhang,Penggang Li

DOI: https://doi.org/10.1002/app.41480

IF: 3

2014-01-01

Journal of Applied Polymer Science

Abstract:ABSTRACTLow dielectric constant polyimide (PI) films have potential applications in integrated circuit. In this study, poly(methyl methacrylate), poly(ethylene oxide), and polystyrene as thermally labile materials were used as templates to generate PI films with nanopores by first mixing the polymer templates with the precursor of PI, poly(amic acid), followed by imidization of poly(amic acid) together with degradation of the polymer templates. The sizes of the formed pores, the thermal and dielectric constant of the nanofoamed PI films were studied and compared in detail. It is concluded that the dielectric constant of PI films using poly(ethylene oxide) as pore template is more stable because of the formation of uniform pores which is from the great accordance of imidization temperature of poly(amic acid) with the degradation temperature of poly(ethylene oxide). But that using poly(methyl methacrylate) as pore template is frequency dependent as the influence of inhomogeneous pores and PMMA residue from incompletely degradation of poly(methyl methacrylate). © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015, 132, 41480.
Preparation and Properties of Nanoporous Polyimide Films with Low Dielectric Permittivity

Zhi‐Min Dang

2011-01-01

Journal of Functional Biomaterials

Abstract:SiO2/polyimide(PI) nanocomposite films with low dielectric permittivity with diamines of pyromellitic dianhydride(PMDA) and 4,4-oxydianiline(ODA) were successfully synthesized by a wet phase inversion process.Then removal of the silica cores of the nano-composite films by HF etching gives rise to the nanoporous of PI films.It is found that the dielectric permittivities of the porous films can be reduced from 3.54 of the pure PI to 3.05(1kHz) by using 15 wt% pore-former(SiO2).The nanopores were characterized by transmission electron microscopy(TEM).The relationships between the structure of the films and the properties,including the dielectric permittivity,the heat resistance,the contact angles and the mechanical strength,were researched.
Synthesis, Characterisation and Enhanced Properties of Polyimide/mica Hybrid Films

X. Cui,G. Zhu,W. Liu

DOI: https://doi.org/10.1080/14658011.2016.1246634

2016-01-01

Abstract:Polyimide/mica (PI/mica) hybrid films were prepared from pyromellitic dianhydride/4,4-bis(3-aminophenoxy)biphenyl (PMDA/4,3-BAPOBP) and mica in a solution of N,N-dimethylacetamide. The structure-property relationships of the composites were studied by means of scanning electron microscopy (SEM), X-ray diffraction (XRD), Fourier transform infrared (FTIR) spectroscopy, ultraviolet-visible spectroscopy and differential scanning calorimetry. FTIR indicated successful preparation of PI/mica hybrid films. XRD and SEM results indicated that the mica was well dispersed in the PI matrix. The dependence of morphology, glass transition temperatures (T-g), dielectric properties and mechanical properties at room temperature of the hybrid films on the content of mica was discussed. It was observed that T-g, the breakdown strength and tensile strength of the hybrid films, could be simultaneously increased when the mica content was lower than 8 wt-%. Meanwhile, the dielectric constant and dielectric loss of PI/mica hybrid films increased with the increase in the mica content.
Synthesis and Properties of Novel Thermoplastic Polyimide

Zhilong Wei,Hong Yue,Guofei Chen,Hongfei Zhang,Jiangtao Liu,Xingzhong Fang

DOI: https://doi.org/10.3969/j.issn.1009-9239.2015.05.004

2015-01-01

Abstract:Using 4,4'-[p-etherbis(phenylenesulfanyl)]diphthalic anhydride(PTPODA) as dianhydride mono-mer, 4,4'-diamino diphenyl ether(ODA) as bisamine monomer, phthalic anhydride(PA) as blocking agent, we synthesized thermoplastic polyimides with different molecular weight by one-step polymerization with different ratios between PTPODA and ODA, and their inherent viscosity was 0.41 dL/g, 0.45 dL/g, 0.53 dL/g respectively. Their thermal stability, solubility, melt flow performance, and mechanical properties were stud-ied. The results show that their glass transition temperature (Tg) is 205~207℃. The decomposition tem-perature at 5% weight loss in air and in nitrogen is 514~531℃ and 519~538℃ respectively. The ten-sile strength is more than 64 MPa, the tensile modulus is above 1.9 GPa, and the elongation at break is higher than 4%. The polyimides have good solubility in polar solvent such as NMP and DMAc. The polyimides have excellent melt processability with melt index of 6.21~9.74 g/10 min at 320℃.
Synthesis and Properties of Copolyimides Based on ODA/TPER

CHAO Min,KOU Kai-chang,WU Guang-lei,ZHANG Jiao-qiang,ZHANG Dong-na,JIANG Yang

DOI: https://doi.org/10.3969/j.issn.1005-5053.2011.3.017

2011-01-01

Abstract:Four polyimides were synthesized via copolymerization of pyromellitic dianhydride(PMDA),4,4'-diaminodiphenyl(ODA) and 1,3-bis(4-aminophenoxy)benzene(TPER) at different monomer ratios.Their properties were characterized by Ubbelohde viscometer,XRD,SEM and TGA.The results showed that the introduction of TPER caused the change of PI films from amorphous to semicrystalline,and also the toughness of PI films was improved by the flexibel chain in the TPER molecules.When the TPER content was low,due to the cooperative effect of crystalline,the excellent thermal stability of PI films was displayed and the 5% weight loss temperature was 558℃ in N2.
Fabrication of Ordered Porous Polyimide Films Templated by (ab)m Type of Diblock Copolymer.

Mengwei Huo,Yibo Wang,Xinbo Wang

DOI: https://doi.org/10.3390/polym15030635

IF: 5

2023-01-01

Polymers

Abstract:Ordered porous polyimide films were fabricated from (AB)m type of diblock copolymer polyimide-b-polystyrene (PI-b-PS). An increase in PS volume fraction (f VPS) is beneficial to decrease the relative dielectric constants and water contact angles of the obtained porous PI films: the relative dielectric constant decreases to 1.89 and water contact angle decreases to 43° when f VPS is 0.36, indicating porous PI films can be used as low-κ material and have good wettability. The solvent uptake of the porous PI films increases with increasing f VPS. A net-like morphology appears when f VPS reaches 0.36. The net-like porous PI film reaches equilibrium uptake of water within approximately 2.5 h, with a final equilibrium uptake ratio of 17.5%, and reaches equilibrium uptake of toluene within approximately 8 h, with a final equilibrium uptake ratio of 15.4%, displaying the highest and fastest solvent uptake compared with other microstructured porous PI films, which is ascribed to the specific characteristic of the interconnecting porous channels derived from the self-assembly of PI-b-PS with f VPS 0.36. Introducing thermally degradable segments to PI-based block copolymer is an effective method to prepare porous PI films and can enhance some of their properties.
Preparation of Porous Polyimide Films by Selective Decomposition of Poly(Methyl Methacrylate) from Pi/Pmma-Blended Films

Hua-Zhen Zhou,Mao-Sheng Zhan,Kai Wang,Xiao-Yan Liu

DOI: https://doi.org/10.1177/0954008312454310

IF: 1.73

2013-01-01

High Performance Polymers

Abstract:A series of porous polyimide (PI) films were prepared by decomposing PI/poly(methyl methacrylate) (PMMA)-blended films at appropriate high temperature for a certain period of time in air. The pore-forming agent, PMMA, was blended with poly(amic acid) (PAA) by in situ blending method. As a thermally labile polymer, PMMA was decomposed first to generate substances with low molecular weight, leaving holes in the original location. Fourier transform infrared (FT-IR) spectra were used to characterize the changes in the chemical structure during the process of preparation of porous PI films. The porous morphology was investigated using field emission scanning electron microscopy. Using FT-IR and thermogravimetric analysis, it was confirmed that PMMA disappeared completely after 4 h at 330°C in air. Thus, porous PI films with major differences between surface and bottom morphologies were prepared successfully. The average pore size of the porous films increased with increasing content of PMMA but was not larger than 1 μm.
Preparation and Properties of Polyimides Based on Bis[3,5-Dimethyl-4-(4-Aminophenoxy)Phenyl]Methane

Yuan,Bao-Ping Lin,Yue-Ming Sun

DOI: https://doi.org/10.1002/app.25750

IF: 3

2007-01-01

Journal of Applied Polymer Science

Abstract:A series of polyimide (PI) thin films were synthesized based on bis[3,5-dimethyl-4-(4-aminophenoxy)phenyllmethane and conventional aromatic dianhydrides. The structures and properties of the thin films were measured with Fourier transform infrared, NMR, thermogravimetric analysis, dynamic mechanical analysis, and impedance analysis. The PI films exhibited glass-transition temperatures in the range of 211-300 degrees C and possessed initial thermal decomposition temperature reaching up to 457-482 degrees C in air and 461-473 degrees C in nitrogen. Some PI films had high solubility in organic solvents such as 1-methyl-2-pyrrolidinone, NN-dimethylformamide, N,N-dimethylacetamide, dimethyl sulfoxide, m-cresol, tetrahydrofuran, and CHCl3. The mechanical properties of these films were also examined. The dielectric constants of the films were in the range of 2.8-3.3 at 25 degrees C. (c) 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 1265-1270, 2007.
Structure and Properties of Thermoplastic Polyimide Based on 4', 4'-(Oxybis (methylene)) Bis ([1.1'- Bipheny]3-Amine) Diamine

Jinshui Lu,Jinyuan Zhang,Heng Liu,Weipeng Chen,Jiangrong Luo,Ziqing Wang,Tingting Cui,Yonggang Min,Yidong Liu

DOI: https://doi.org/10.1177/09540083231191416

IF: 1.73

2023-01-01

High Performance Polymers

Abstract:In this work, a new diamine was designed by connecting flexible structures such as ether bond and aliphatic carbon chain between benzene rings, and was synthesized and purified through simple reactions such as Suzuki reaction. Finally, a series of polyimide (PI) films were synthesized by copolymerization with 4.4`-diaminodiphenyl ether (ODA)\pyromellitic dianhydride (PMDA) in different proportions. We prepared polyimide films with new monomer copolymerization ratios of 1% (PI-1), 5% (PI-2), 10% (PI-3), and 20% (PI-4). The polyimide films showed excellent glass transition temperatures, which were attributed to their unique bent architectures. The mechanical and thermal properties of the thermosets were studied using tensile testing, static thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). As the results, the films exhibited the optimal glass transition temperatures (317.56 & DEG;C-381.91 & DEG;C), and the component with the highest copolymerization ratio has a 15% decrease in glass transition temperature compared to the component without copolymerization. Moreover, PI-1-PI-4 showed good heat resistance in the N2 atmosphere. The temperatures corresponding to a 5% heat loss in the films (T5%) were 458.12 & DEG;C-548.75 & DEG;C, respectively.
Polymerization, Structure and Thermal Properties of Odpa-Dmb Polyimide Films

Young Ho Kim,Bong Seok Moon,F. W. Harris,S. Z. D. Cheng

DOI: https://doi.org/10.1007/bf01983611

1996-01-01

Journal of Thermal Analysis

Abstract:A new high molecular weight polyimide based on 4,4′-oxidiphthalic anhydride (ODPA) dianhydride and 2,2′-dimethyl-4,4′-diaminobiphenyl (DMB) diamine has been synthesizedvia a one-step polymerization method. This polyimide is soluble in phenolic solvents. Films from 7 to 30 μm thick were cast from the polymer solution and show in-plane orientation on a molecular scale detected by Fourier transform infrared spectroscopy experiments. This anisotropic structure leads to anisotropic optical properties arising from two different refractive indices along the inplane and out-of-plane directions. ODPA DMB possesses high thermal and thermo-oxidative stability. The glass transition temperature has been determined to be 298 °C. Dynamic mechanical analyses show two relaxation processes appearing above room temperature: the β- and the α-relaxation processes. The α-relaxation corresponds to the glass transition while the β-relaxation is a secondary relaxation process associated with the non-cooperative subsegmental motion.
Emerging ionic liquid-induced porous polyimide films toward ultralow permittivity, improved hydrophobic and electromagnetic wave absorption

Xiaodi Dong,Baoquan Wan,Ming-Sheng Zheng,Haiping Xu,Jiefeng Gao,George Chen,Jun-Wei Zha

DOI: https://doi.org/10.1016/j.polymer.2022.125382

IF: 4.6

2022-11-08

Polymer

Abstract:There is an urgent need for interlayer dielectric materials with ultralow dielectric properties, high temperature resistance and hydrophobicity in the field of microelectronics due to the development of high-density integration and miniaturization of electronic components. Herein, porous polyimide (PI) films were successfully prepared by using ionic liquid (1-Butyl-3-methylimidazolium tetrafluoroborate, [BMIM][BF4]) as porogen for the first time. Based on the inherent good compatibility between [BMIM][[BF4] and polyimide, this ionic liquid could be uniformly dispersed in the PI matrix, thus creating a favorable prerequisite for the formation of pores. It was demonstrated that the optimized rearrangement of PI molecular chains induced by etching process of [BMIM][BF4] led to the generation of pores and the reduction of chain spacing, which endow the porous films excellent dielectric, thermal and mechanical properties. The film with the porosity ratio of 85 vol% exhibited minimum permittivity of 1.5 at a wide range from 102 to 106 Hz, high temperature of 5% weight loss about 532 °C. The porous PI films not only provide the promising ultralow permittivity dielectric materials for the development of modern integrated circuits, but also present potential application in adsorption separation and special electromagnetic detection.

polymer science
Synthesis of new copolyimides containing pyridine and morpholine groups for gas separation through molecular design and simulation

Jing Ni,Hongchao Niu,Shiqing Lai,Chanjuan Liu,Li Zhou,Lichun Wang,Xiaohua Huang

DOI: https://doi.org/10.1002/app.52994

IF: 3

2022-08-20

Journal of Applied Polymer Science

Abstract:Via a one‐step copolymerization reaction, a kind of new morpholinyl polyimide was synthesized and characterized, and also applied in gas separation field. This morpholinyl polyimide displays outstanding properties and respectable gas separation applications. Through molecular simulation, the simulation results further confirmed the reliability of experimental data. Through one‐step copolymerization of 4‐(4‐[1‐morpholinyl]phenyl)‐2,6‐bis(4‐aminophenyl)pyridine (MPAP), 9,9‐bis(4‐aminophenyl)fluorene (BAFL), and (4,4′‐hexafluoroisopropylidene)diphthalic anhydride (6FDA), a series of polyimides containing morpholine group, pyridine ring, fluorene "cardo" pendant and hexafluoroisopropyl group are obtained. The synthesized polyimides have good thermal stability, high transparency, outstanding hydrophobicity and excellent solubility in not only high‐boiling solvents but also low boiling‐point solvents. Furthermore, polyimide films have large molecular chain spacing, which is consistent with the free volume calculated by molecular simulation. Consequently, polyimide membranes display better gas permeability values of CO2 (up to 24.47 Barrer) and He (up to 45.04 Barrer), and good ideal gas selectivity values of CO2/N2 (up to 15.33 Barrer) and He/N2 (up to 23.89 Barrer), which also shows potential application of polyimide matrix materials in gas separation.

polymer science
Nonfluorinated Copolymerized Polyimide Thin Films with Ultralow Dielectric Constants

Yuan,Bao-Ping Lin,Xue-Qin Zhang,Li-Wei Wu,Yao Zhan

DOI: https://doi.org/10.1002/app.28524

IF: 3

2008-01-01

Journal of Applied Polymer Science

Abstract:A series of copolymerized polyimide (PI) thin films with low dielectric constants were prepared with different molars ratio of bis[3,5-dimethyl-4-(4aminophenoxy)phenyl]methane and 9,9-bis[4-(4-aminophenoxy)phenyl]fluorene as diamines and 4,4'-(4,4'-isopropylidenediphenoxy)bis(phthalic anhydride) as a dianhydride. Some films possessed good dielectric properties with an ultralow dielectric constant of 2.3 at 1 MHz. The structures and properties of the thin films were measured with Fourier transform infrared and NMR spectroscopy, thermogravimetric analysis, and dynamic mechanical analysis. The PI films exhibited glass-transition temperatures in the range 223-243 degrees C and possessed initial thermal decomposition temperatures reaching up to 475-486 degrees C in air and 464-477 degrees C in nitrogen. All of the PI films exhibited excellent solubility in organic solvents. The mechanical properties of these films were also examined. (C) 2008 Wiley Periodicals, Inc.
Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides

Hong Li,Xiyan Li,Jiali Yu,Yadong Li,Zhigang Wang,Feng Bao,Caizhen Zhu,Jian Xu

DOI: https://doi.org/10.1039/d3tc04195f

IF: 6.4

2023-12-12

Journal of Materials Chemistry C

Abstract:As Ultra Large-Scale Integration (ULSI) circuits develop quickly, traditional polyimide (PI) urgently needs modification due to its high dielectric constant, making it meet the requirements of ULSI development. In this study, the o-hydroxy polyimide structure was introduced into the PI main chain, and it was confirmed that the thermal rearrangement reaction of o-hydroxy polyimide could increase the molar volume of PI. Based on this property, this study successfully prepared low dielectric polyimide resins and meticulously investigated the effect of the rearrangement ratio on the properties of PI, especially the dielectric properties. The results show that the Dk of PI decreases significantly and the glass transition temperature (Tg) increases significantly with the increase of rearrangement ratio. Among them, it is worth mentioning that PBO-40 has the best performance, presenting a low dielectric constant (Dk= 2.54@10GHz), low dielectric loss (Df= 0.00585@10GHz), high heat resistance (Tg=315 ‚ÑÉ, 5% decomposition temperature (N2) Td5%= 509 ‚ÑÉ) and low water absorption (Ma=0.65%). In conclusion, this study provides learnable strategies for the design of high-frequency dielectric PIs. Keywords: polyimide, dielectric constant, benzoxazole, triphenyl pyridine structure, trifluoro methylene

materials science, multidisciplinary,physics, applied

Morphology and Properties of Porous Polyimide Films Prepared Through Thermally Induced Phase Separation

Morphology and Dielectric Property of Cellular Polyimide Films Prepared by Phase Inversion

Synthesis and Properties of Ultralow Dielectric Constant Porous Polyimide Films Containing Trifluoromethyl Groups

Synthesis And Characterization Of Porous Polyimide Films Containing Benzimidazole Moieties

Preparation of Porous Polyimide Film with Low Didectric Constant by Nonsolvent Induced Phase Separation

Mesoporous polyetherimide thin films via hydrolysis of polylactide-b-polyetherimide-b-polylactide

2021 pioneering investigator issue: mesoporous polyetherimide thin films <i>via</i> hydrolysis of polylactide-<i>b</i>-polyetherimide-<i>b</i>-polylactide

Effect of Polymer Structure on the Morphologies and Dielectric Properties of Nanoporous Polyimide Films

Preparation and Properties of Nanoporous Polyimide Films with Low Dielectric Permittivity

Synthesis, Characterisation and Enhanced Properties of Polyimide/mica Hybrid Films

Synthesis and Properties of Novel Thermoplastic Polyimide

Synthesis and Properties of Copolyimides Based on ODA/TPER

Fabrication of Ordered Porous Polyimide Films Templated by (ab)m Type of Diblock Copolymer.

Preparation of Porous Polyimide Films by Selective Decomposition of Poly(Methyl Methacrylate) from Pi/Pmma-Blended Films

Preparation and Properties of Polyimides Based on Bis[3,5-Dimethyl-4-(4-Aminophenoxy)Phenyl]Methane

Structure and Properties of Thermoplastic Polyimide Based on 4', 4'-(Oxybis (methylene)) Bis ([1.1'- Bipheny]3-Amine) Diamine

Polymerization, Structure and Thermal Properties of Odpa-Dmb Polyimide Films

Emerging ionic liquid-induced porous polyimide films toward ultralow permittivity, improved hydrophobic and electromagnetic wave absorption

Synthesis of new copolyimides containing pyridine and morpholine groups for gas separation through molecular design and simulation

Nonfluorinated Copolymerized Polyimide Thin Films with Ultralow Dielectric Constants

Preparation of fluorinated poly(benzoxazole-co-imide) with low dielectric constants based on the thermal rearrangement reaction of o-hydroxy polyimides