Abstract:The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging. Key Features: •Covers ceramics and glasses, polymers, metals, metallic composites, multi-material laminates, carbonaceous materials, and carbon-matrix composites •Provides the reader with a comprehensive understanding of thermal management solutions •Includes fundamentals of heat transfer and materials characterization techniques •Assesses cost and performance in thermal management

Thermal Conduction Phenomena In Advanced Interface Materials For Electronic Cooling

Present and future thermal interface materials for electronic devices

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

Recent advances in polymer-based thermal interface materials for thermal management: A mini-review

Exploring Thermal Interface Materials for Electronics Via Molecular Dynamics Simulations: A Review

Advanced Materials for Thermal Management of Electronic Packaging

Spatial Thermal Conductivity Variation of Particulate-Filled Thermal Interface Materials

Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

Heat conduction of electrons and phonons in thermal interface materials

Research progress on solder thermal interface materials

A Review of Advanced Thermal Interface Materials with Oriented Structures for Electronic Devices

The effect of thermal contact resistance on heat management in the electronic packaging

Interface Phonon Scattering Suppression Boosts Heat Conduction in Thermal Interface Materials

2D Materials‐Based Thermal Interface Materials: Structure, Properties, and Applications

Improvement of interfacial thermal resistance between TIMs and copper for better thermal management

A comprehensive review on thermal management of electronic devices

Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling

Advances on thermal conductive epoxy‐based composites as electronic packaging underfill materials – A review

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Scanning thermal microscopy evaluation of interface thermal property of composites for electronic packaging

Constructing the Snail Shell-Like Framework in Thermal Interface Materials for Enhanced Through-Plane Thermal Conductivity