Microwave Packaging of High - Speed Semiconductor Lasers

N. H. Zhu,S. J. Zhang,C. Chen,Y. Liu,C. Liu,E.Y.B. Pun,P. S. Chung

DOI: https://doi.org/10.1364/ipra.2005.iwa1

2005-01-01

Abstract:Many new and different packaging types of high-speed semiconductor lasers have been developed to meet the rapidly increasing demand. This paper describes the recent progress in the microwave issues of high-speed semiconductor laser packaging.

What problem does this paper attempt to address?

Advancing Integrated Photonics and Microreactor Technologies with Ultrafast Laser Processing

Min Wang,Zhiwei Fang,Jia Qi,Junxia Zhou,Zhe Wang,Rongbo Wu,Renhong Gao,Ni Yao,Sanaul Haque,Saeed Farajollahi,Jintian Lin,Wei Fang,Tao Lu,Wei Chu,Ya Cheng

DOI: https://doi.org/10.1117/12.2585248

2021-01-01

Abstract:We present our latest progresses on the development of integrated photonic devices as well as microfluidic chips of unprecedented characteristics and performances using femtosecond laser micromachining. We demonstrate ultra-high Q microresonators in lithium niobate on insulator (LNOI), on-chip micro-laser and waveguide amplifier, and high-throughput micro-chemical reactor. The achievements are the result of persistent effort on improving the precision and efficiency in ultrafast laser processing.
Microwave Packaging Of High-Speed Optoelectronic Devices

H Yang,Kx Chen,W Sun,W Shi,Dh Li,Mb Yi

DOI: https://doi.org/10.1117/12.445722

2001-01-01

Abstract:We use a new impedance graded line that is backland coplanar wave-guide to design transmission line. During the permission of measurement scope on project, we can perform arbitrarily matching for5Omega-75Omega, calculated in the method of quasi-static analysis, using the microwave matching network and high-frequency encapsulation, we can improve our work frequency and effective power effectively.
Microwave Packaging for 10-Gb/s EML Modulators

Y Liu,L Xie,HQ Yuan,JB Zhang,NH Zhu,CZ Sun,B Xiong,B Luo

DOI: https://doi.org/10.1117/12.636469

2005-01-01

Abstract:A novel microwave packaging technique for 10Gb/s electro-absorption modulator integrated with distributed feedback laser (EML) is presented. The packaging parasitics and intrinsic parasitics are both well considered, and the packaging circuit was synthetically designed to compensate for the intrinsic parasitic of the chip. A butterfly-packaged EMI module has been successfully developed to prove that. The small-signal modulation bandwidth of the butterfly-packaged module is about 10 GHz. Optical fiber transmission experiments have shown that the module can be used for 10Gb/s optical transmission system. After transmission through 40km,. the power penalty is less than 1 dBm at a bit-error-rate of 10-12.
Toward On-Chip Unidirectional and Single-Mode Polymer Microlaser

Xue-Peng Zhan,Ying-Xin Xu,Huai-Liang Xu,Qiu-Lan Huang,Zhi-Shan Hou,Wei Fang,Qi-Dai Chen,Hong-Bo Sun

DOI: https://doi.org/10.1109/jlt.2017.2671402

IF: 4.7

2017-01-01

Journal of Lightwave Technology

Abstract:Optical microcavities have been paid enormous attentions as a basic integrated element in photonic devices including micromodulators, microfilters, and microsensors. In particular, the microcavities that can produce unidirectional and single-mode lasing emissions are greatly demanded to meet the challenge of integrating high-efficiency and high-sensitivity optical functional systems. Herein, a three-dimensional polymer microlaser composed of stacked circular-ring-shaped and spiral-ring-shaped microcavities is fabricated directly on a narrow bandpass filter substrate by the femtosecond laser processing technique. The on-chip polymer microlaser provides a room-temperature, low-threshold, unidirectional, and single-mode laser output, resulting from the coupling between the two stacked microcavities. The fabrication of the on-chip low-threshold polymer microlaser opens up a possibility toward the integration of a variety of polymer microcavities for organic optoelectronic devices.
High-speed packaging for silicon modulator

Yadong Liu,Tao Chu

DOI: https://doi.org/10.3390/optofluidics2017-04387

2017-01-01

Abstract:This paper reports a high-speed packaging for Silicon Mach-Zehnder modulators (MZMs). The radio frequency (RF) input port of the package is commercially available GPPO type. High-frequency ceramic substrate is designed to shorten the length of gold wire to suppress the RF attenuation. Gratings and single-mode fibers using inclined-surface coupling are used to realize low-loss and large tolerance coupling. In measurement, clear eye diagrams with ER of 10.1 dB and 7.6 dB were obtained at 25 Gb/s and 40 Gb/s modulations. Silicon photonics has become a hot research topic in the field of optoelectronics in recent years, since silicon–based optical device can achieve high density integration, low power consumption, low cost photonic devices, realize monolithic integration with electronic devices, and it is compatible with traditional CMOS processes [1]. Silicon electro-optic modulators which are key devices in optoelectronic information transmission and processing have got great developments in recent years. High speed OOK silicon modulators have been demonstrated [2-4]. The silicon modulator packaging has also been studied [5-6]. However, the operating speed of packaged silicon modulators still need to be improved. Our butterfly package for silicon modulator is illustrated in Figure 1. Two main designs were applied for high speed packaging: the modulator chip was designed with reverse PN mode, whose PN junction capacitance is smaller and the modulator electrode was carefully designed using CPW travelling-wave electrodes; GCPW transmission lines with metallic holes were adopted to fabricate the high-frequency ceramic substrates to make the high-speed electrical signal effective loading on the electrode of the MZM chip. Since micro-strip-like line (MSL) mode in GCPW line might exist, which usually cause energy coupling of CPW mode and prompt a microwave resonant of transmission response in high frequency range [7], we made metallic holes on a transmission line to suppress the microwave resonant [8-9]. Grating coupler and single-mode fiber with inclined-surface are used in optical coupling. The advantages of this optical coupling method is larger misalignment tolerance and cheap cleaved fiber packaging. Nickel metal tube is installed close to the inclined-surface of single-mode fiber, the position and angle of the optical fiber is adjusted by special fixture clamping nickel metal tube and adjusting the special fixture. Assuming the optical fiber is parallel to the chip surface, there is a relation of θ=2*φ-90o. We choose the φ=51 deg. as our grating incidence angle is 12 degree. Eye-diagram measurements were carried to demonstrate the high-speed operation of the packaged modules. Experimental results were presented in Fig. 4(a) and 4(b). Clear eye diagrams with ERs of 10.1 dB and 7.6 dB were obtained at 25 Gb/s and 40 Gb/s modulation speed. By improving the welding between the pin of GPPO connector and ceramic substrates, further reducing the length of gold wires from the ceramic substrates to the modulator pads, the speed of the packaged MZM module could be higher.
Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology

Yixiong Yan,Yu Zheng,Haigang Sun,Ji’an Duan

DOI: https://doi.org/10.3389/fphy.2021.669591

IF: 3.718

2021-05-12

Frontiers in Physics

Abstract:In the past 20 years, semiconductor lasers have been widely used in medical, industrial, and communication applications, providing a revolutionary and powerful platform for the fifth generation and advanced manufacturing. Semiconductor laser has the advantages of small size, lightweight, high reliability and easy modulation, becoming increasingly popular. However, due to the laser diode emission mechanism limitation, the beam quality is inferior and cannot be directly applied and required to be handled by beam shaping. However, the packaging of multiple beam shaping optical components is accompanied by risks due to misalignment. The misalignment error of the optical components has a great hidden danger to the laser performance. As semiconductor lasers' power gradually increases, lasers' thermal management technology is also increasingly strict. Therefore, this article first reviews the beam shaping technology of semiconductor laser diode array. Secondly, the analysis of the influence of the array semiconductor laser optical device's misalignment is reviewed, and a feasible solution is proposed. Finally, it summarizes the researches on thermal management in high-power semiconductor lasers. This article aims to give readers a comprehensive and broad understanding of semiconductor laser packaging's technical difficulties and to recognize each corresponding solution.

physics, multidisciplinary
Design and Research of Laminated Packaging Structure for Semiconductor Laser Diode

Peidong Xu,Bin Wang,Yang Qian,Yong Wang,Yunjie Teng,Xiantao Wang

DOI: https://doi.org/10.3390/coatings12101450

IF: 3.236

2022-10-02

Coatings

Abstract:The primary factor influencing semiconductor laser performance is photoelectric conversion efficiency. In this study, a heat sink structure in the form of a laminated DC-mount package was created using Solidworks 2018 in accordance with the semiconductor laser C-mount packaging structure specifications. The Workbench 17.0 program theoretically derived the link between the device's junction temperature and power, and then optimized the size of its heat sink. The primary characteristics of semiconductor laser devices with various C-type and DC-type heat sink architectures were then packaged and compared. Results demonstrate that thermal resistance decreased by 31%, the power of the semiconductor laser device with a DC packaging structure increased by 0.5 W, and photoelectric conversion efficiency increased to over 60%, thereby lowering the temperature at the device junction and thermal resistance. at least to a certain point. the effect of the parasitic parameters of the package is effectively improved. Finally, the 3000 h life test confirmed this package construction's stability.

materials science, multidisciplinary,physics, applied, coatings & films
Thermal Modeling and Analysis of High Power Semiconductor Laser Arrays

Zhiyong Zhang,Pu Zhang,Xiaoning Li,Lingling Xiong,Hui Liu,Zhiqiang Nie,Zhenfu Wang,Xingsheng Liu

DOI: https://doi.org/10.1109/icept-hdp.2012.6474681

2012-01-01

Abstract:With the continuous increase of the output power of semiconductor laser array, the heat generation in the active region also increases continuously, which influences the performances and lifetime of semiconductor laser array seriously. In order to improve the performances and lifetime, understanding of the thermal behavior of high power semiconductor laser array packages and optimizing the thermal performance are crucial. By means of numerical analysis, a three-dimensional thermal model has been established, and the static and transient thermal characteristics in continuous-wave (CW) and quasi-continuous-wave (QCW) modes also have been studied systematically for a hard solder, conduction-cooled-packaged 808nm semiconductor laser array. Based on the thermal modeling and analysis, the approaches to reduce thermal resistance have been proposed. The results show that: compared with copper-tungsten (CuW), adopting the copper-diamond composite material as the submount can decrease the thermal crosstalk behavior between emitters, and reduce the thermal resistance by about 30%. In addition, a novel thermal design for the packaging structure of the mounting heat-sink is demonstrated, which has the ability of reducing the thermal resistance of the devices significantly.
Package Technology for Microcavities

Wen-Dong Zhang,Ying-Zhan Yan,Jun Liu,Shu-Bin Yan,Chen-Yang Xue,Ji-Jun Xiong

DOI: https://doi.org/10.1117/12.893474

2011-01-01

Abstract:Although Microcavities are promising in a variety of novel devices, there is slow development in microcavity based practical devices due to the lack of the package technology. In this paper, for the first time, we demonstrate the package technology for the microcavity coupling system to promote the development of the microcavity based practical applications. The package process are illustrated in detail. The changes which result from the package are also discussed. In addition, the advantages of the packaged structure are characterized, including the Q maintenance, robustness and the convenience. These advantages make this packaged structure promising in microcavity based practical devices.
Recent Developments of Quantum Dot Materials for High Speed and Ultrafast Lasers

Zhonghui Yao,Cheng Jiang,Xu Wang,Hongmei Chen,Hongpei Wang,Liang Qin,Ziyang Zhang

DOI: https://doi.org/10.3390/nano12071058

IF: 5.3

2022-03-24

Nanomaterials

Abstract:Owing to their high integration and functionality, nanometer-scale optoelectronic devices based on III-V semiconductor materials are emerging as an enabling technology for fiber-optic communication applications. Semiconductor quantum dots (QDs) with the three-dimensional carrier confinement offer potential advantages to such optoelectronic devices in terms of high modulation bandwidth, low threshold current density, temperature insensitivity, reduced saturation fluence, and wavelength flexibility. In this paper, we review the development of the molecular beam epitaxial (MBE) growth methods, material properties, and device characteristics of semiconductor QDs. Two kinds of III-V QD-based lasers for optical communication are summarized: one is the active electrical pumped lasers, such as the Fabry–Perot lasers, the distributed feedback lasers, and the vertical cavity surface emitting lasers, and the other is the passive lasers and the instance of the semiconductor saturable absorber mirrors mode-locked lasers. By analyzing the pros and cons of the different QD lasers by their structures, mechanisms, and performance, the challenges that arise when using these devices for the applications of fiber-optic communication have been presented.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
Study on design of high-power fiber fused components

REN Jian-guo,SHEN Zi-qing,ZHANG Wei-an,YANG Hua-yong

DOI: https://doi.org/10.3969/j.issn.1001-5078.2012.05.001

2012-01-01

Abstract:High-power fiber lasers have seen astonishingly rapid progress over the last decade.All-fiber laser systems are preferred for simplicity,compactness,robustness and reliability.Characterized by intrinsically low transmission loss,fused components are referred to the optimum choices.Losses can lead to catastrophic component failure due to localized heating at high power levels.The most meaningful benchmark,when considering the power handling of the component,is the capability of the component to handle optical power loss,rather than transmitted power.Design criterions of low transmission loss are described both in single-mode components and multi-mode components.Some advices about package design are proposed.
Researches in Microwave Photonics Based Packages for Millimeter Wave System with Wide Bandwidth and Large Dynamic Range

Xiaoping Zheng,Shangyuan Li,Hanyi Zhang,Bingkun Zhou

DOI: https://doi.org/10.1007/s12200-016-0622-3

2016-01-01

Abstract:This paper presents an introduction to the researches in microwave photonics based packages and its application, a 973 project (No. 2012CB315600), which focuses on addressing new requirements for millimeter wave (MMW) system to work with higher frequency, wider bandwidth, larger dynamic range and longer distance of signal distribution. Its key scientific problems, main research contents and objectives are briefed, and some latest achievements by the project team, including generation of linear frequency modulation wave (LFMW), tunable optoelectronic oscillator (OEO) with lower phase noise, reconfigurable filter with higher Q value, time delay line with wider frequency range, down conversion with gain, and local oscillator (LO) transmission with stable phase, are introduced briefly.
Microwave Imaging of Delaminations in IC Packages

Y Ju,M Saka,H Abe

DOI: https://doi.org/10.1063/1.1472835

2002-01-01

AIP Conference Proceedings

Abstract:Delaminations, which may occur between the chip pad and the encapsulant resin in IC packages, have been inspected by microwave imaging technique. For further increasing the sensitivity of the measurement, optimization of standoff distance between the sensor aperture and the sample surface is discussed. By using the optimum standoff distance, full and part delaminations are detected. The good inspection capability and no necessity of any coupling medium of this technique offer a new approach for the integrity assessment of IC packages.
A Novel Optical Path for Enhancing the Performance of High-Power Semiconductor Laser in Packaging

M. J. Mellink

DOI: https://doi.org/10.3390/sym14081721

2022-08-19

Symmetry

Abstract:High-power semiconductor laser has more significant applications in long distance and high-reliability optical communication systems. It is noticed that the packaging plays an important role in the performance of high-power semiconductor laser, including high output power, high coupling efficiency, low relative intensity noise (RIN), and so on. Usually, in a symmetrical optical path, the light, which incident directly parallel to the optical axis of the lens, will be partially reflected back to the laser and cause noise. To solve this problem, a novel asymmetric optical path is designed and implemented to meet the requirement of using a high-power laser with low RIN in this work. By employing an isolator between the first and second lens, the laser with high beam quality and low reflection of the signal was achieved. Moreover, the optical focal length of the collimating lens and the angle of the inclined lens were optimized by simulation. The proposed laser exhibited high coupling efficiency with a RIN of −168.89 dB/Hz. According to theoretical and experimental analysis, the performance of the laser will be helpful in fabricating a high-power laser with low RIN for next-generation optical communication.
Microwave Imaging for the Integrity Assessment of IC Packages

Y Ju,M Saka,H Abe

DOI: https://doi.org/10.1115/1.1326440

2000-01-01

Journal of Electronic Packaging

Abstract:Since IC packages have been made thinner and smaller, the delamination and crack, which may be induced in the soldering process, have become important factors affecting the reliability of the package. The ability to penetrate deeply inside dielectric materials, and to reflect completely at the metal surface makes microwave inspection very suitable to detect such delamination. The authors have recently developed a new microwave imaging technique that uses an open-ended coaxial line sensor to detect the delamination in IC packages. The image was created by measuring the phase of the effective reflection coefficient at the aperture of the coaxial line sensor. For better evaluation of the shape and the size of the delamination, a method to further increase the spatial resolution of microwave imaging was studied in the present paper. The resolution affected by the dimensions of the sensor, the frequency of operation, and the standoff distance between the sensor and the sample was investigated by experiment. The experimental results indicate that microwave imaging is a promising technique for the integrity assessment of IC packages.
Microwave Package Design for Superconducting Quantum Processors

Sihao Huang,Benjamin Lienhard,Greg Calusine,Antti Vepsäläinen,Jochen Braumüller,David K. Kim,Alexander J. Melville,Bethany M. Niedzielski,Jonilyn L. Yoder,Bharath Kannan,Terry P. Orlando,Simon Gustavsson,William D. Oliver

DOI: https://doi.org/10.1103/prxquantum.2.020306

2021-04-16

PRX Quantum

Abstract:Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront of quantum information processing. However, high-fidelity, simultaneous control of superconducting qubits at even a moderate scale remains a challenge, partly due to the complexities of packaging these devices. Here, we present an approach to microwave package design focusing on material choices, signal line engineering, and spurious mode suppression. We describe design guidelines validated using simulations and measurements used to develop a 24-port microwave package. Analyzing the qubit environment reveals no spurious modes up to 11 GHz. The material and geometric design choices enable the package to support qubits with lifetimes exceeding 350μs. The microwave package design guidelines presented here address many issues relevant for near-term quantum processors.

English Else
Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

L. Carroll,S. Collins,M. Rensing,P. Morrissey,P. O'Brien,Yan Zhao,C. Eason,Matthieu Duperron,Huihui Lu,How Yuan Hwang,Jun-Su Lee,K. Gradkowski,C. Scarcella

DOI: https://doi.org/10.3390/APP6120426

2016-12-15

Abstract:Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved.

Physics,Engineering
High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

Ping Guo,Hongling Meng,Lin Dan,Hao Xu,Jianye Zhao

DOI: https://doi.org/10.3390/app11188536

2021-01-01

Applied Sciences

Abstract:Vacuum packaging of Micro-electro-mechanical system (MEMS) devices is a hot topic for its advantages of improving performance and reducing power consumption. In this paper, the physics package of a chip scale atomic clock (CSAC), as a typical kind of MEMS device, is performed by vacuum packaging based on a systematic method proposed by us. The whole process, including low outgassing and thermal stable materials selection, prebaking for desorption, getter firing for absorption and solder reflow for vacuum sealing is introduced thoroughly. The thermogravimetric analysis or thermal gravimetric analysis (TGA) is used to analyze the thermal stability and desorption of materials. The leak rate of physics packages is measured to be less than 4 × 10−10 Pa·m3/s by helium leak detection. The residual gas pressure and composition in physics packages are analyzed after vacuum packaging. The results show a high vacuum ~0.1 Pa in the physics package. The frequency stability is improved from 4.68 × 10−11 to 1.07 × 10−11 @40,000 s. The presented method for high vacuum packaging is also applicable to other MEMS devices.
Microwave Signal Processing Using High Speed Silicon Optical Modulators

Linjie Zhou,Yanyang Zhou,Minjuan Wang,Yiming Zhong,Yujie Xia,Jianping Chen

DOI: https://doi.org/10.1364/acpc.2016.as2e.2

2016-01-01

Abstract:We review our recent progress on the high-speed silicon optical modulators for microwave signal processing applications. Various functions including microwave phase shift, frequency multiplication and linear modulation have been realized.
High-speed Optoelectronic Devices

Yi Luo,Changzheng Sun,Bing Xiong,Jian Wang,Zhibiao Hao,Yanjun Han,Hongtao Li,Lai Wang

DOI: https://doi.org/10.1007/s11432-022-3669-5

2023-01-01

Science China Information Sciences

Abstract:High-speed optoelectronic devices are key components of modern fiber communication systems, and the backbone of information technology. In this paper, we present our work on high-speed devices over the past decades, including high-performance semiconductor lasers and integrated light sources, wideband electro-optic modulators, high saturation power photodetectors, and their applications in both fiber communications and microwave photonics. Gain-coupled distributed feedback (DFB) lasers were fabricated with high single-mode yield. Electroabsorption modulated lasers (EMLs) were demonstrated based on identical epitaxial layer integration scheme, including single channel 40 Gb/s EMLs, and 4 × 25 and 4 × 56 Gb/s EML arrays. Both InP and thin-film lithium niobate based low half-wave voltage electro-optic modulators with modulation bandwidth over 40 GHz were demonstrated. Back-illuminated modified uni-traveling-carrier photodetectors (MUTC-PDs) with high saturation power and bandwidth exceeding 100 GHz were developed. Applications of high-speed optoelectronic devices in fiber-optic links and sub-THz wave generation are presented.

Microwave Packaging of High - Speed Semiconductor Lasers

Advancing Integrated Photonics and Microreactor Technologies with Ultrafast Laser Processing

Microwave Packaging Of High-Speed Optoelectronic Devices

Microwave Packaging for 10-Gb/s EML Modulators

Toward On-Chip Unidirectional and Single-Mode Polymer Microlaser

High-speed packaging for silicon modulator

Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology

Design and Research of Laminated Packaging Structure for Semiconductor Laser Diode

Thermal Modeling and Analysis of High Power Semiconductor Laser Arrays

Package Technology for Microcavities

Recent Developments of Quantum Dot Materials for High Speed and Ultrafast Lasers

Study on design of high-power fiber fused components

Researches in Microwave Photonics Based Packages for Millimeter Wave System with Wide Bandwidth and Large Dynamic Range

Microwave Imaging of Delaminations in IC Packages

A Novel Optical Path for Enhancing the Performance of High-Power Semiconductor Laser in Packaging

Microwave Imaging for the Integrity Assessment of IC Packages

Microwave Package Design for Superconducting Quantum Processors

Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

High Vacuum Packaging of MEMS Devices Containing Heterogeneous Discrete Components

Microwave Signal Processing Using High Speed Silicon Optical Modulators

High-speed Optoelectronic Devices