Microwave Imaging of Delaminations in IC Packages

Y Ju,M Saka,H Abe
DOI: https://doi.org/10.1063/1.1472835
2002-01-01
AIP Conference Proceedings
Abstract:Delaminations, which may occur between the chip pad and the encapsulant resin in IC packages, have been inspected by microwave imaging technique. For further increasing the sensitivity of the measurement, optimization of standoff distance between the sensor aperture and the sample surface is discussed. By using the optimum standoff distance, full and part delaminations are detected. The good inspection capability and no necessity of any coupling medium of this technique offer a new approach for the integrity assessment of IC packages.
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