Abstract:High melting point metals and their alloys have wide use as coating materials because of their improved properties. A good understanding of the bonding mechanism between the coating layer and the substrate is therefore a very important concern in thermal spray processing of these high melting point materials. In this work we have conducted a numerical study of the cooling and solidification of such materials, and in particular of the substrate melting and resolidification for a substrate impacted by a high melting point droplet. A model has been developed and a non-dimensional analysis led to the identification of the independent non-dimensional parameters controlling the process. Numerical solutions of this complex coupled problem enabled us to calculate the temperature history in both deposit and substrate, including the phase change phenomena. The critical conditions needed for substrate melting in the case of given pairs of deposit and substrate materials were quantified from systematic deposit and substrate temperature analyses, and are presented in terms of non-dimensional operational maps of wide applicability. Information on the critical conditions under which the substrate surface melts, and on the maximum melting depth achieved into the substrate was also generated for various process parameters including deposit undercooling, initial substrate temperature, and variations in deposit–substrate interfacial heat transfer coefficient.

Numerical Study on Substrate Remelting, Flow, and Resolidification in Microcasting

Modeling of Substrate Remelting, Flow, and Resolidification in Microcasting

Numerical study of the melting and resolidification of the substrate during the impact of a ceramic droplet in a plasma spraying process

Numerical Investigation of Substrate Melting and Deformation During Thermal Spray Coating by SPH Method

A Numerical Analysis on the Metal Droplets Impacting and Spreading out on the Substrate

Effect of Contact Resistance and Substrate Melting on Thermal Spray Coating

Thermal analysis and measurements for a molten metal drop impacting on a substrate: cooling, solidification and heat transfer coefficient

Numerical Simulation of a Metal Drop in Impinging on Substrate

The Experiment and Numerical Simulation of Al Droplets Collision

Studies of splat morphology and rapid solidification during thermal spraying

Melting and resolidification of a substrate in contact with a molten metal: operational maps

3D Numerical Simulation of Successive Deposition of Uniform Molten Al Droplets on a Moving Substrate and Experimental Validation

Deposition of a Molten Layer of High Melting Point Material: Substrate Melting and Resolidification

Numerical simulation of nucleation, solidification, and microstructure formation in thermal spraying

Numerical Investigation of Pileup Process in Metal Microdroplet Deposition Manufacture.

Experimental Determination of the Interfacial Heat Transfer During Cooling and Solidification of Molten Metal Droplets Impacting on a Metallic Substrate: Effect of Roughness and Superheat

Numerical Simulation and Validation of Metal Micro-droplet Deposition Forming

Numerical analysis of pileup process in metal microdroplet deposition manufacture

A numerical study on non-spherical droplet impact with solidification in additive manufacturing

Modeling of Temperature and Residual Stress Fields Resulting from Impacting Process of a Molten Ni Particle Onto a Flat Substrate

Solidification process of hollow metal droplets impacting a substrate