In-Situ SEM Testing for Transient Fatigue Crack Growth Behavior Investigation Subjected to a Single Tensile Overload

Wei Zhang,Yongming Liu

DOI: https://doi.org/10.1115/imece2014-37703

2015-01-01

Abstract:In this paper, the in-situ scanning electron microscopy (SEM) experiments are performed in the edge-cracked specimen under the single overload in order to investigate transient fatigue crack growth behavior. The specimen is made of Al7075-T6 and under the plane stress condition. During the testing, several loading cycles of interest are selected and divided into a certain number of steps. At each step, high resolution images around the crack tip region are taken under the SEM. Imaging analysis is used to quantify the crack tip opening displacement (CTOD) at each corresponding time instant in a loading cycle. In the current experimental work, the crack closure phenomenon is not only directly observed under constant amplitude loadings, but also under the variable amplitude loading. The experimental results provide the evidence that the crack closure may disappear or become inconsequential right after the single overload. And some observations imply that the crack closure is not the only parameter which controls fatigue crack growth rate, other factors need to be considered. A detailed discussion is given based on the current investigation.