Systematic Insight into Chloride Concentration, Applied Potential and Time Effect on the Passive Film of Cu-Zn-Ni Ternary Alloy in Alkaline Solution
Li Wang,Decheng Kong,Chaofang Dong,Binbin Zhao,Chang He,Yunyang Wan,Cheng Man,Xiaogang Li
DOI: https://doi.org/10.1007/s11665-018-3449-9
IF: 2.3
2018-07-10
Journal of Materials Engineering and Performance
Abstract:The effects of chloride concentration, applied potential and time on the passive film of Cu-Zn-Ni ternary alloy in alkaline solution were systematically investigated using potentiodynamic and potentiostatic polarizations, electrochemical impedance spectroscopy, Mott–Schottky analysis, laser confocal microscopy, atomic force microscopy and x-ray photoelectron spectroscopy. Results showed that the pitting potential decreased as a linear function of log(aCl-documentclass[12pt]{minimal}usepackage{amsmath}usepackage{wasysym}usepackage{amsfonts}usepackage{amssymb}usepackage{amsbsy}usepackage{mathrsfs}usepackage{upgreek}setlength{oddsidemargin}{-69pt}egin{document}$$ a_{{{ ext{Cl}}^{ - } }} $$end{document}), and the size of pits extended faster in the horizontal direction than in the vertical direction. The passive oxide film formed on Cu-Zn-Ni alloy mainly exhibited p-type semiconductor behavior, which was consistent with cuprous and nickel oxide, the main components in the film. The density of cation vacancy (approximately 1020-1021 cm−3) increased with potentiostatic time but reduced by the increasing potentials. The kinetics of passive film growth followed a parabolic law D = m * tn, where m is a constant considered as the initial growth rate and n is the time exponent. Subsequent to the formation of a compact and coherent passive film at higher potential, it was hard for an ion to migrate or for an aggressive ion to penetrate, which indicated better corrosion resistance for passive film formed under higher potential.
materials science, multidisciplinary