Abstract:Solder bridging is a commonly seen and serious processing defect in electronic packaging, which may lead to short circuit even absolute failure of electronic devices and products. Solder bridging may occur in all types of solder interconnects and in each of soldering processes during manufacturing journey, for example, in ball grid array solder interconnects and three-dimensional (3D) interconnects, as well as in wave soldering and reflow soldering assemblies. With the increasing trend of electronic products towards miniaturization and multifunction, the pitch and size of solder interconnects have been scaling down. The finer pitch and decreased size of solder joints greatly increase the difficulty of soldering process and the solder bridging defect is more likely to appear. Notably, the laser jet solder ball bonding (LJSBB) with the advantages of localized heating and higher energy inputting provides a novel soldering technology for 3D packaging, for instance, the right-angle solder interconnects and temperature-sensitive components. When fabricating the right-angle solder interconnects, the liquid solder ball is blown by the protected N-2 flow and hardly stays firmly in place during the LJSBB process, thus the solder bridging occurs more often in the LJSBB process. Under such circumstances, it is necessary to identify the essential factors causing solder bridging of right-angle solder interconnects and seeking the improvement measures for mass production. In this study, the crucial factors causing solder bridging of right-angle Au/Sn-3.0Ag-0.5Cu/Au interconnects during LJSBB process have been investigated and identified. The results demonstrate that the poor wetting and the large displacement are the main reasons causing the solder bridging defect. The composition analysis and surface morphology characterization results manifest that the contamination of Au bonding pads and a thicker oxidation layer on the surface of solder balls significantly prolong the time of the metallurgical reaction between the solder and Au pads, which results in poor wetting of the molten solder and consequently the solder bridging defect. The verification experiments indicate that a large displacement obviously increases the waving probability of the liquid solder ball. Thus, the solder bridging defect occurs more easily. In addition, the impurities attached onto the nozzle can occasionally lead to the solder bridging defect in mass production.

Fillet-lifting Phenomenon of Wave Soldering with Sn-Bi-Ag-Cu Solder

Fillet-lifting mechanism for Sn-Bi-Ag-Cu solder joint in lead-free wave soldering

Study on Electromigration Mechanism of Lead-Free Sn3.5Ag0.5Bi8.0In Solder Joints

Dynamic Wetting Behavior and Solder Ball Spattering Formation of Sn-Bi Solder Pastes During Reflow Soldering Process

Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn–3.0Ag–0.5Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging

Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration

Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58bi/Cu Solder Interconnect During Reflow Soldering Process

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Phase Field Study of the Combined Effects of Electromigration and Thermomigration on Phase Segregation and Physical Properties of Sn58Bi Solder Joints under Electric Current Stressing Coupled with Temperature Gradient

Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling

Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid-Solid Reactions

Phase Field Simulation of the Microstructural Evolution and Electromigration-Induced Phase Segregation in Line-Type Cu/Sn-Bi/Cu Solder Interconnects

Incomplete Dissolved Behavior and Mechanical Analysis of SnAgCu-SnBi Composite Solder Structures for High-Reliable Package-on-package Techniques

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Identification of Essential Factors Causing Solder Bridging of Right-Angle Solder Interconnects in Laser Jet Solder Ball Bonding Process

Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

Microstructural evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr solder under high-temperature and high-humidity conditions

Effect of Solidification Mode on Microstructure and Properties of Sn-Bi Solders

Microstructural Evolution and Mechanical Properties of Sn‐58Bi Solder Alloys with Different Cooling

Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability