Abstract:Sn-Bi based alloys are widely used as thermal interfacial materials, solders in electronic packaging, thermal fuse and low temperature resistant performance electronic components. However, the inherent tendency of microstructure coarsening and phase segregation in Sn-Bi alloys under thermal loading can easily lead to the inhomogeneous mechanical and thermal response behavior, which can promote crack initiation and expansion near the interface between two major phases (i.e., Bi-rich and Sn-rich phases), and this has brought about serious reliability concern for the above applications and thus attracted increasing attention in recent years. In this study, a phase field model is developed to simulate the microstructural evolution and phase segregation behavior of the eutectic Sn58Bi solder in a line-type Cu/Sn58Bi/Cu interconnect under the condition of isothermal aging and temperature gradient respectively. Results show that the Bi-rich phase and Sn-rich phase distribute inhomogeneously in the Sn58Bi alloy matrix of the solder interconnect during thermal aging; the large size Bi-rich phase particles grow up at the expense of the small size ones, and the value of coarsening exponent n is 0.17. Under temperature gradient, Bi atoms migrate along the direction of the heat flux, and consequently a Bi-rich phase segregation layer forms on the cold end, while a Sn-rich phase area is left on the hot end. The relationship between the temperature gradient distribution and the microstructural characteristics is well revealed. Moreover, the phase segregation under temperature gradient induces the decrease of thermal conductivity, which in turn deteriorates the heat transfer performance of solder interconnects. In addition, comparing the coarsening behavior of the Bi-rich phase under temperature gradient with that during isothermal aging, it is clear that the temperature gradient leads to faster coarsening of the Bi-rich phase, and there is a linear relationship between the mean equivalent radius of the Bi-rich phase and nondimensional time. Finally, the study of thermomigration kinetics of the Bi-rich phase shows that the thickness of the Bi-rich phase segregation layer increases almost linearly with nondimensional time, which is consistent with the theoretical analysis.

Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid-Solid Reactions

Role of Grain Boundary Character on Bi Segregation-Induced Embrittlement in Ultrahigh-Purity Copper

Effect of Bi Segregation on the Asymmetrical Growth of Cu-Sn Intermetallic Compounds in Cu/Sn-58Bi/Cu Sandwich Solder Joints During Isothermal Aging

Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects

Phase Field Simulation of Microstructural Evolution and Thermomigration-Induced Phase Segregation in Cu/Sn58Bi/Cu Interconnects under Isothermal Aging and Temperature Gradient

Interfacial reaction and mechanical properties of Sn–Bi Cu core solder joints

Effect of electromigration on the microstructural evolution and shear fracture behavior of mixed assembled Cu/Sn–3.0Ag–0.5Cu-ball/Sn–58Bi-paste/Cu joints in board-level packaging

Interfacial Reactions and Microstructural Evolution of BGA Structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu Mixed Assembly Joints During Isothermal Aging

Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

Microstructure changes in Sn-Bi solder joints reinforced with Zn@Sn particles in thermal cycling and thermomigration

Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58bi/Cu Solder Interconnect During Reflow Soldering Process

Phase Field Simulation of the Microstructural Evolution and Electromigration-Induced Phase Segregation in Line-Type Cu/Sn-Bi/Cu Solder Interconnects

Interfacial Reaction Between Novel High Entropy Alloy SnPbInBiSb and Cu Substrate

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

Phase Field Study of the Combined Effects of Electromigration and Thermomigration on Phase Segregation and Physical Properties of Sn58Bi Solder Joints under Electric Current Stressing Coupled with Temperature Gradient

Effect of Cu on the diffusion behavior of Bi in Sn matrix during electromigration

Microstructural evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr solder under high-temperature and high-humidity conditions

Impacts of temperature gradient on microstructure and properties of Cu/ Sn58Bi-0.6B4C NPs/Cu joints fabricated by vacuum thermal compression bonding

Interfacial Reactions And Reliability Of Sn-Zn-Bi-Xcr Solder Joints With Cu Pads

Impacts of Temperature Gradient on Microstructure and Properties of Cu/Sn58Bi-0.6B4C NPs/Cu Joints Fabricated by Vacuum Thermal Compression Bonding

Microstructural Evolution and Change in Macroscopic Physical Properties of Microscale Flip Chip Cu/Sn58Bi/Cu Joints under the Coupling Effect of Electric Current Stressing and Elastic Stress