Abstract:Bi-doped Sn-Ag-Cu (SAC) microelectronic solder is gaining attention for its utility as a material for solder joints that connect substrates to printed circuit boards (PCB) in future advanced packages, as Bi-doped SAC is reported to have a lower melting temperature, higher strength, higher wettability on conducting pads, and lower intermetallic compound (IMC) formation at the solder-pad interface. As solder joints are subjected to aging during their service life, an investigation of aging-induced changes in the microstructure and mechanical properties of the solder alloy is needed before its wider acceptance in advanced packages. This study focuses on the effects of 1 to 3 wt.% Bi doping in an Sn-3.0Ag-0.5Cu (SAC305) solder alloy on aging-induced changes in hardness and creep resistance for samples prepared by high cooling rates (>5 °C/s). The specimens were aged at ambient and elevated temperatures for up to 90 days and subjected to quasistatic nanoindentation to determine hardness and nanoscale dynamic nanoindentation to determine creep behavior. The microstructural evolution was investigated with a scanning electron microscope in tandem with energy-dispersive spectroscopy to correlate with aging-induced property changes. The hardness and creep strength of the samples were found to increase as the Bi content increased. Moreover, the hardness and creep strength of the 0-1 wt.% Bi-doped SAC305 was significantly reduced with aging, while that of the 2-3 wt.% Bi-doped SAC305 increased with aging. The changes in these properties with aging were correlated to the interplay of multiple hardening and softening mechanisms. In particular, for 2-3 wt.% Bi, the enhanced performance was attributed to the potential formation of additional Ag3Sn IMCs with aging due to non-equilibrium solidification and the more uniform distribution of Bi precipitates. The observations that 2-3 wt.% Bi enhances the hardness and creep strength of the SAC305 alloy with isothermal aging to mitigate reliability risks is relevant for solder samples prepared using high cooling rates.

Incomplete Dissolved Behavior and Mechanical Analysis of SnAgCu-SnBi Composite Solder Structures for High-Reliable Package-on-package Techniques

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution

Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints

Solidification Behavior and Mechanical Properties of Sn-2.5Ag-0.8Cu-0.05Ni-1Bi and Sn-0.75Cu-0.065Ni-1.5Bi Solder Alloys, and Microstructures in Joints Formed Using Them

Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints

Interfacial reaction and mechanical properties of Sn–Bi Cu core solder joints

Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling

Interfacial reaction and mechanical properties of Sn58Bi-XCr solder joints under isothermal aging conditions

Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn-Ag-Cu-Bi Solder

Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin

The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition

Microstructure evolution and mechanical properties of Sn-9Zn-2.5Bi-1.5In solder joints with aging treatment under various conditions

Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

Crystallographic Structure and Mechanical Behaviour of SnAgCu Solder Interconnects under a Constant Loading Rate

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Effect of Nano-Cu 6 Sn 5 upon development mechanism of Cu–Ni–Sn compounds and mechanical characteristics for mixed solder joints

An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures