Abstract:The 2.5D packaging technology is a high–performance method for electronic packaging. This study addresses the reliability issues of 2.5D packaging during the manufacturing process. A multi–physics field coupling Finite Element Method (FEM) has been developed, combined with sub–modeling techniques, to investigate the curing of underfill adhesive, the curing of Epoxy Molding Compound (EMC), and the reflow soldering between the interposer and substrate in a 2.5D packaging entity during various manufacturing procedures. The focus is on the thermo–mechanical–chemical behavior of viscoelastic components within the packaging structure, as well as the viscoplastic characteristics of the micro solder balls and microbumps. A systematic analysis is conducted on the warpage deformation and stress distribution of the 2.5D packaging at crucial time points. The results demonstrate that after curing, the overall warpage of the packaging exhibits a 'concave' warpage profile. Additionally, as the thickness of the EMC above the chip increases, the warpage value of the packaging also increases. The warpage value defined by linear elasticity is larger than that defined by viscoelasticity. The maximum Von Mises stress value in the key areas of the submodel is greater than the maximum Von Mises stress value in the corresponding key areas of the global model. After reflow soldering, the stress concentration in the micro solder balls occurs at the edge of the micro solder ball array. The maximum stress values for each component of the packaging are observed in the interface areas between the components. Packaging components that undergo the curing process have notably higher warpage and Von Mises stress values than those that do not undergo the curing process. The simulation method established in this study can accurately predict the warpage deformation and stress distribution state of 2.5D packaging, providing significant engineering application value for process optimization and reliability enhancement of 2.5D packaging in the production process.

Effects Of Various Assembly And Reliability Stresses On Chip To Package Interaction

Computational Analysis of Mechanical and Electromigration Reliability Problems

Dynamic Substructure Method for Prediction of Solder Joint Reliability of IC Package under Drop Test

Simulation and Experimental Analysis of Thermomechanical Stress Around Interconnects for W2W Hybrid Bonding

Modeling of interconnect stress evolution during BEOL process and packaging

Effects Of Combining Hygro-Thermal Stress On Reliability Of Plastic Qfn Package

An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

Research on the Stress in Stacked Chip Packages

Stress Modeling for the Impacts of Flip Chip Process on the Ultralow-K Chips

Impact of Fabrication Process, Layout Variation and Packaging Process on Cu/Low-k Interconnect Reliability

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Board level FEA reliability and stress modeling for chip-to-wafer bonded chiplet package

Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package Interaction

Stress Distribution of Stacked Chip Package in Curing Process

Reliability Issues of Low-Cost Overmolded Flip-Chip Packages

Viscoelastic Modeling and Reliability Assessment of Microelectronics Packages

Effects of Hygro-Thermal Stress on the Reliability of Package-on-Package

New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors

Reliability Analysis of Bumping Schemes under Chip Package Interaction

Multi-scale Finite Element Simulation of 2.5D Advanced Packaging for Integrated Circuits during Manufacturing Process

Numerical Analysis of Packaging-Induced Failures in Cu/Low-k Interconnects