Numerical Investigation of Flow Boiling Characteristics in Narrow Rectangular Channels Using Two-Fluid Eulerian Cfd Model Covering a Wide Range of Pressures
Jinyu Han,Wen He,Yao Liu,Deyang Gao,Chenru Zhao,Hanliang Bo
DOI: https://doi.org/10.1016/j.applthermaleng.2024.123982
IF: 6.4
2024-01-01
Applied Thermal Engineering
Abstract:Narrow channel heat exchange technology is one of the key technologies for the development of integrated small modular reactors (SMR). The 'wall heat flux partitioning' (WHFP) model in conjunction with an Eulerian-Eulerian Multiphase Flow (EEMF) method is found to be an important tool for two-phase hydrothermal analysis. In this paper, the accuracy of the EEMF-WHFP method with various sub-models is systemically evaluated over a large database of boiling flows in narrow rectangular channels. Prediction results using a total of 9 model combinations, are compared with data from 22 experimental conditions covering a range of the mass flux of 134.2 to 2200 kgm-2s-1, the inlet fluid subcooling of 7.2 to 74.2 K, the pressure of 0.1 to 14 MPa and the heat flux of 9.54 to 1700 kWm-2 in narrow rectangular channels with gaps of 1.0 to 3.0 mm. The evolution of distributions of void fraction, wall temperature and the net vapor generation (NVG) point along the flow channel is simulated and compared with experimental data. It is found that due to the limitation of the range of applicability of sub-models, certain models produced better prediction results under different pressure ranges than others, and the recommended combinations are given according to the quantitative assessments. In addition, the ability of the model combinations to predict the NVG point, as well as the flow structure and boiling process in narrow channels is investigated. The critical local void fraction near the wall at the NVG point is quantitatively estimated based on numerical results. The research conclusions in this paper can be used in thermal-hydraulic calculations in a wide range of operating pressures covering the applications of compact heat exchangers, flat plate fuels, climbing/falling film plate evaporators and the cooling of microelectronics, among other applications.