Abstract:The continuous and aggressive downscaling of conventional CMOS devices has been driving the vast growth of ICs over the last few decades. As the CMOS downscaling approaches the fundamental limits, novel device architectures such as metallic source/drain Schottky barrier MOSFET (SB-MOSFET) and SB-FinFET are probably needed to further push the ultimate downscaling. The ultimate goal of this thesis is to integrate metallic Ni1-xPtx silicide (x=0~1) source/drain into SB-MOSFET and SB-FinFET, with an emphasis on both material and processing issues related to the integration of Ni1-xPtx silicides towards competitive devices. First, the effects of both carbon (C) and nitrogen (N) on the formation and on the Schottky barrier height (SBH) of NiSi are studied. The presence of both C and N is found to improve the poor thermal stability of NiSi significantly. The present work also explores dopant segregation (DS) using B and As for the NiSi/Si contact system. The effects of C and N implantation into the Si substrate prior to the NiSi formation are examined, and it is found that the presence of C yields positive effects in helping reduce the effective SBH to 0.1-0.2 eV for both conduction polarities. In order to unveil the mechanism of SBH tuning by DS, the variation of specific contact resistivity between silicide and Si substrates by DS is monitored. The formation of a thin interfacial dipole layer at silicide/Si interface is confirmed to be the reason of SBH modification. Second, a systematic experimental study is performed for Ni1-xPtx silicide (x=0~1) films aiming at the integration into SB-MOSFET. A distinct behavior is found for the formation of Ni silicide films. Epitaxially aligned NiSi2-y films readily grow and exhibit extraordinary morphological stability up to 800 oC when the thickness of deposited Ni (tNi) <4 nm. Polycrystalline NiSi films form and tend to agglomerate at lower temperatures for thinner films for tNi≥4 nm. Such a distinct annealing behavior is absent for the formation of Pt silicide films with all thicknesses of deposited Pt. The addition of Pt into Ni supports the above observations. Surface energy is discussed as the cause responsible for the distinct behavior in phase formation and morphological stability. Finally, three different Ni-SALICIDE schemes towards a controllable NiSi-based metallic source/drain process without severe lateral encroachment of NiSi are carried out. All of them are found to be effective in controlling the lateral encroachment. Combined with DS technology, both n- and p-types of NiSi source/drain SB-MOSFETs with excellent performance are fabricated successfully. By using the reproducible sidewall transfer lithography (STL) technology developed at KTH, PtSi source/drain SB-FinFET is also realized in this thesis. With As DS, the characteristics of PtSi source/drain SB-FinFET are transformed from p-type to n-type. This thesis work places Ni1-xPtx (x=0~1) silicides SB-MOSFETs as a competitive candidate for future CMOS technology.

Ultrathin Ni1-Xptx Films As Electrical Contact in Cmos Devices

Understanding Solid-State Interactions: Ultrathin Ni1-xPtx Silicide Films Formed on Si(100)

Myth and Facts in the Formation of Ultrathin Ni-Pt Silicide Films

Kinetics and Morphology of Ni1-xPtx-silicide Epitaxy on Si(001)

Ti and NiPt/Ti Liner Silicide Contacts for Advanced Technologies

Morphological Stability and Specific Resistivity of Sub-10 Nm Silicide Films of Ni1−xPtx on Si Substrate

Investigation of Ultrathin Ni Germanosilicide for Advanced pMOS Contact Metallization

Self-aligned Silicides for Ohmic Contacts in Complementary Metal–oxide–semiconductor Technology: TiSi2, CoSi2, and NiSi

Exploitation of a Self-Limiting Process for Reproducible Formation of Ultrathin Ni1−xPtx Silicide Films

Role of ultra-thin tungsten interlayer in blocking nitrogen diffusion and reducing specific contact resistivity in titanium/n+-Si ohmic contacts

Low Contact Resistivity of Ti/TiN/Al for NiSi2 on Epitaxial Si:P Structure at Full Low-Temperature Process below 450 °C

Formation and properties of ternary silicide (CoxNi1-x)Si2 thin films

Nickel-Based Contact Metallization For Sige Mosfets: Progress And Challenges

Phase formation and morphological stability of ultrathin Ni-Co-Pt silicide films formed on Si(100)

Conformal Ni-Silicide Formation over Three-Dimensional Device Structures

Metal Silicides In Advanced Complementary Metal-Oxide-Semiconductor (Cmos) Technology

Interaction of NiSi with dopants for metallic source/drain applications

Surface-energy Triggered Phase Formation and Epitaxy in Nanometer-Thick Ni1−xPtx Silicide Films

Formation and properties of ternary silicide (Co/sub x/Ni/sub 1-x/)Si/sub 2/ thin films

Design on Formation of Nickel Silicide by a Low‐Temperature Pulsed Laser Annealing Method to Reduce Contact Resistance for CMOS Inverter and 6T‐SRAM on a Wafer‐Scale Flexible Substrate

Atomic-scale silicidation of low resistivity Ni-Si system through in-situ TEM investigation