Abstract:The fast kinetics of the low-temperature microstructure evolution in nanocrystalline metals requires an additional driving force from the excess intragrain energy in addition to the driving forces from the grain boundary energy, surface or interface energy, and thermal strain energy. If the excess volume of the grain boundary induces lattice distortions in grain interiors, the intragrain energy is the elastic-strain energy and can be determined from a grain-size-dependent strain model. Considering the available intragrain strain energy, we use transmission electron microscopy, x-ray diffraction line-broadening analysis, and theoretical models to investigate the kinetics and energetics of room-temperature nanostructure relaxation and abnormal grain growth in electroplated nanocrystalline Cu films devoid of thermal strains and high-density dislocations. The experimental data of grain sizes and microstrains are consistent with the theoretical size-dependent strain model. The limited nanostructure relaxation of Cu occurs with the grain boundary width reduction and intragrain strain release, which cannot alter the structural anisotropy and intrinsic high-energy state of nanograins. Based on quantitative descriptions of the variations in grain size, microstrain, and transformed fraction during abnormal grain growth, the possible driving forces and grain boundary mobility were systematically evaluated. The results indicate that the size-dependent intragrain strain energy provides a crucial driving force for rapid nanograin growth and texture transition, whereas the low nanograin boundary mobility in Cu films is probably correlated with the strained-lattice migration and faceted-boundary migration.

Rapid Stress-Driven Grain Coarsening in Nanocrystalline Cu at Ambient and Cryogenic Temperatures

Effect of cryogenic impact deformation and subsequent annealing on microstructure and microhardness of pure copper

The Influence Of Time, Temperature, And Grain Size On Indentation Creep In High-Purity Nanocrystalline And Ultrafine Grain Copper

Grain Coarsening During Compression of Bulk Nanocrystalline Nickel and Copper

Grain Coarsening in Nanocrystalline Copper with Very Small Grain Size During Tensile Deformation

Mechanically-induced Grain Coarsening in Gradient Nano-Grained Copper

Grain Coarsening Behavior in a Nanocrystalline Copper Subjected to Sliding Friction

Thermal Stability of Nanocrystalline Grains in Cu-W Films

Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Investigation of microstructure thermal evolution in nanocrystalline Cu

Nanocrystalline Grain Structures Developed in Commercial Purity Cu by Low-Temperature Cold Rolling

On The Origin Of Ultrahigh Cryogenic Strength Of Nanocrystalline Metals

Microstrain effect on thermal properties of nanocrystalline Cu

Molecular dynamics study of the effect of extended ingrain defects on grain growth kinetics in nanocrystalline copper

Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Kinetics and Energetics of Room-Temperature Microstructure in Nanocrystalline Cu Films: the Grain-Size Dependent Intragrain Strain Energy

Effect of temperature on near-surface microstructural evolution in nanocrystalline metal under shear stress

Repetitive Ultra-low Stress Induced Nanocrystallization in Amorphous Cu‒Zr‒Al Alloy Evidenced Byin Situnanoindentation

The Influence of Grain Size and Temperature on the Mechanical Deformation of Nanocrystalline Materials: Molecular Dynamics Simulation

Grain size effects on the compressibility and yield strength of copper

Strain Hardening in Gradient Nano-Grained Cu at 77 K