Microstructure Characterization of AlxCo1Cr1Cu1Fe1Ni1 (x=0 and 2.5) High-Entropy Alloy Films

Z. F. Wu,X. D. Wang,Q. P. Cao,G. H. Zhao,J. X. Li,D. X. Zhang,Jian-Jun Zhu,J. Z. Jiang
DOI: https://doi.org/10.1016/j.jallcom.2014.04.094
IF: 6.2
2014-01-01
Journal of Alloys and Compounds
Abstract:Co20Cr20Cu20Fe20Ni20 (at.%) (Al-0) and Al33.35Co13.33Cr13.33Cu13.33Fe13.33Ni13.33 (at.%) (Al-2.5) high-entropy alloy films with thicknesses less than 500 nm were successfully fabricated by sputter technique using alloy targets. Their microstructures are characterized by X-ray diffraction, scanning electron microscopy, X-ray photoelectron spectrometer, transmission electron microscopy and nanoindentation techniques. It is found that compositions for both films are uniformly in depth. The both as-deposited films are composed of nanometer-sized grains with serious lattice distortion. The as-deposited Al-2.5 film, having a hardness of 15.4 GPa and reduced Young's modulus of 203.8 GPa, exhibits a body-centered cubic structure and remains stable up to 873 K for 20 min whereas the as-deposited Al-0 film, having a hardness of 6.3 GPa and reduced Young's modulus of 87.9 GPa, exhibits a face-centered cubic structure and remains up to 773 K for 20 min. It seems that due to high temperature structure stability and high hardness, the Al-2.5 film could be used as a potential coating material on high-temperature Ni-based alloys. (C) 2014 Elsevier B.V. All rights reserved.
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