Effects of Ti content on microstructure and shape memory behavior of Ti x Ni (84.5− x ) Cu 15.5 ( x =44.6–55.4) thin films

akira ishida,morio sato,zhiyong gao

DOI: https://doi.org/10.1016/j.actamat.2014.02.006

IF: 9.4

2014-01-01

Acta Materialia

Abstract:Ti-Ni-Cu films with Cu and Ti contents of 15.5 and 44.6-55.4 at.%, respectively, were prepared by sputtering and their structure and shape memory behavior after annealing for 1 h at 773, 873 and 973 K were investigated. The Cu content of the B2 phase was constant for the Ti-rich films, but decreased with decreasing Ti content for the (Ni,Cu)-rich films. The (Ni,Cu)-rich films annealed at 773 K were supersaturated with Ni. The grain size of the Ti-rich films was smaller than that of the (Ni,Cu)-rich films. These differences corresponded to the difference in the shape memory behavior. The martensitic transformation start temperature was almost constant for the Ti-rich films annealed at 873 and 973 K, but decreased with decreasing Ti content for the (Ni,Cu)-rich films. The critical stress for slip was larger for the Ti-rich films than for the (Ni,Cu)-rich films. The maximum recoverable strain was smaller for the Ti-rich films than for the (Ni,Cu)-rich films. The relationship between the structure and shape memory behavior is discussed. (c) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.