Abstract:This study deals with the Nb–niobium silicide-based composites developed by the hot-pressing of Nb–Si–Ti ternary powder mixtures with a fixed Ti addition (6at.%) and Si content ranging from hypereutectic (11at.%) to near-eutectic compositions (18at.%). The effects of Si content, Ti addition and strain rates on the sample microstructural characterization, flexural strength, fracture toughness, quasi-static compressive deformation and failure processes were investigated. It was revealed that the volume fraction of silicides increased with increasing Si content, and most of the Ti atoms dissolved into the niobium silicides to form (Nb,Ti)5Si3 solid solutions instead of binary titanium silicides. The experimental evidence showed that a moderate improvement in the flexural strength, fracture toughness and compressive yield stress of the composites was achieved by the addition of Ti. Higher Si additions produced a much more remarkable enhancement in the compressive yield stress and bulk hardness, whereas both the flexural strength and fracture toughness decreased with increasing Si content owing to the existence of residual porosities in the samples. The composites showed remarkable superiority to the arc-melted Nb–Si alloys and monolithic niobium silicides in fracture toughness (8.3–13.0MPam vs. 4.5MPam), where the toughening effect was attributed mainly to crack bridging and crack deflection by the remaining ductile Nb phase. Moreover, quasi-static uniaxial compression tests at strain rates between 10–5 and 10–3s−1 indicated that the deformation behavior and failure processes were significantly affected by Si content and strain rates. The strain-rate-hardening behavior for all the strain rates was observed in the composite materials and the strain-rate sensitivity decreased with increasing Si content. At a lower strain rate, the composite materials with a hypoeutectic Si composition failed with a pseudoplastic response and at an angle of ∼45° off the compressive loading direction. However, in the case of higher strain rate and Si content, the brittle failure in the samples occurred through vertical splitting and spalling of fragments.

Cross-sectional Transmission Electron Microscopy Study of the Influence of Niobium on the Formation of Titanium Silicide in Small-Feature Contacts

Electrical Properties Of The Tisi2-Si Transition Region In Contacts: The Influence Of An Interposed Layer Of Nb

Study of NiSi/Si Interface by Cross-Section Transmission Electron Microscopy

Formation of C54 TiSi2: Effects of Niobium Additions on the Apparent Activation Energy

I – V – T Studies on Ni-silicide/n-Si(100) Contacts Formed by Ti–Ni–Si Solid State Reaction

Ni Silicide Formation on Polycrystalline SiGe and SiGeC Layers

Formation of Ni Mono-Germanosilicide on Heavily B-doped Epitaxial SiGe for Ultra-Shallow Source/drain Contacts

In Situ Characterization of Titanium Silicide Formation: the Effect of Mo Interlayer, Temperature Ramp-Rate, and Annealing Atmosphere

X-ray photoelectron spectroscopy study of NiSi formation on shallow junctions

Surface-Morphology Study of Titanium Silicide Formed on Polycrystalline Silicon

Role of ultra-thin tungsten interlayer in blocking nitrogen diffusion and reducing specific contact resistivity in titanium/n+-Si ohmic contacts

Nickel Silicide Formation on Shallow Junctions

In-situ Transmission Electron Microscope Investigation of Atomic-scale Titanium Silicide Monolayer Superlattice

Atomic-scale silicidation of low resistivity Ni-Si system through in-situ TEM investigation

In-situ nanoscale characterization of composition and structure during formation of ultrathin nickel silicide

Influence of Ti Interlayer on Untrathin Ni Film Silicidation

Effect of erbium interlayer on nickel silicide formation on Si(100)

Microstructural and mechanical characterization of Nb-based in situ composites from Nb–Si–Ti ternary system

Different Routes to the Formation of C54tisi(2) in the Presence of Surface and Interface Molybdenum: A Transmission Electron Microscopy Study

Interaction of NiSi with dopants for metallic source/drain applications

The Formation of C54 TiSi2 in The Presence of Implanted or Deposited Molybdenum