Studies of Etching Mechanism of Polyimide Films on Silicon Chips

G XUE

DOI: https://doi.org/10.1002/apmc.1986.051420105

1986-01-01

Die Angewandte Makromolekulare Chemie

Abstract:The etching mechanism of polyimide films on silicon chips has been studied. As the film contacts with alkaline solution, the imide bonds hydrolyze quickly, resulting in the formation of polyions. The polyion coils are expanded by electrostatic repulsion. Within the etching time, most part of the polyimide dissolves into solution. The remaining gel contains 10% of original imide bonds and has a molecular weight of 12,000. The gel is not a classical one, but a physical gel which contains relatively small polymer molecules jointed by secondary forces.