Study on SF6 Decomposition Characteristics under Thermal Fault and Its Representation Method

Jianyu Pan,Ju Tang,Qiang Yao,Cunchao Wang,Fuping Zeng

DOI: https://doi.org/10.1109/ceidp.2013.6747081

2013-01-01

Abstract:SF6 electrical equipments always occur thermal fault developed from local overheating by poor contact. To find out SF6 decomposition characteristics under thermal fault temperature and improve the method of using the decomposed components of SF6 to indentify electrical fault, this paper exploited SF6 thermal decomposition model to conduct serials of experiments. This paper firstly revealed the SF6 thermal decomposition initial temperature. Then it found out the types of decomposed components, analyzed their formation regularity and identified the most stable characteristic components in SF6 thermal decomposition. Finally, a representation method was established by using characteristic component to represent the thermal fault information. The results show that: SF6 begins to decompose at 300°C and it contains CO2, SO2F2, SOF2, SOF4, SO2 and H2S, but no CF4; the improvement of fault temperature will promote the formation of decomposed components, but the influence regularity of each component is different; the established correlation picture and diagnosis table can effectively represent SF6 fault temperature information.