Abstract:With the high speed development of information technology, the circuit assembly density becomes higher, which caused that the power density and the demand for heat dissipation increase. The traditional packaging metals such as copper, aluminum play a good performance on the heat conduction, but a higher heat mismatch stress is caused by the difference of the thermal expansion coefficient between packing metals and ceramic materials. Kolar alloy can solve the problem, but its thermal conductivity is to low (less 20 times than Cu). W/Cu, Mo/Cu alloy could meet the demand for high fever guide and low inflation, but they have large density (> 8.9 g/cm3). So a new type of material with a low inflation, high thermal conductivity and light is demanded in the aerospace field. Al/SiC composites materials is expected to replace the first and the second generation special electronic packaging alloy because of the low density, low inflation and high thermal conductivity. Therefore, the reflow soldering between the Al-SiC composites materials for heat sink and ceramic substrates have extensive significance[1,2]. In this paper, we reflowed the 63Sn37Pb/Ni-plated Al-SiC carrier and thick film hybrid circuit coated palladium silver slurry with two kinds of solder paste ,63Sn37Pb and 62Sn36Pb2Ag. The effect of the thermal shock resistance of the Pd-Ag coat on the thick film ceramic substrate and the 63Sn37Pb/Ni film on Al-SiC was determined by the water quenching method. The microstructure of the joint was observed by SEM. The thickness of the PdAg film was bigger with SnPbAg solder paste than SnPb, which meaned that the element Ag made a effect on coating corrosion resistance. After a long time about 400 hours of the heat cycle test, no cracks were found by SEM and the joint microstructure remained relatively uniform.

Reflow Influence for Sn96.7-Ag3.7 Polymer Core Solder Ball in BGA Package

IMC integrity for Sn96.7-Ag3.7 polymer core solder ball in BGA package

Drop test for Sn96.7-Ag3.7 polymer core solder ball in BGA package

Oxygenous reflow affecting performance of Pb-free TFBGA assembly

Nickel solder ball performance for Pb-free LFBGA assembly under oxygenous reflow

Solder Stability for Pb-free HBGA Assembly with Oxygenous Reflow

Thermomechanical Behaviour of Pbga Package During Laser and Hot Air Reflow Soldering

Reliability of lead-free fine pitch BGA under thermal and mechanical impact

Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework

Solder Volume Effects on the Microstructure Evolution and Shear Fracture Behavior of Ball Grid Array Structure Sn-3.0Ag-0.5Cu Solder Interconnects

Research on Microstructure of Pb-Free Bga Solder Joint Assembled with Sn-Pb Solder During Isothermal Aging

Process Optimization for Enhancing Interconnect Performance of Large-Size BGA Component During Vibration Loading

Dynamic Wetting Behavior and Solder Ball Spattering Formation of Sn-Bi Solder Pastes During Reflow Soldering Process

Research of Reflow Soldering on Al-SiC Composite Material and Thick Film Ceramic Substrates

Study on Laser and Hot Air Reflow Soldering of PBGA Solder Ball

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing

Incomplete Dissolved Behavior and Mechanical Analysis of SnAgCu-SnBi Composite Solder Structures for High-Reliable Package-on-package Techniques

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

Numerical Simulation on Temperature Distribution of PBGA Package during Laser Reflow Process

Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture

Interfacial Reaction Between Pbga Solder Ball and Au/Ni/Cu Pad During Laser Reflow