Abstract:A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. First, the entire computational domain is divided into the internal subdomain including the substrate sandwiched between the power and ground planes and the external subdomain surrounding the power-ground planes. The internal subdomain is modeled by using the integral equation with dyadic Green's functions of the rectangular cavity, while the free-space Green's function is used to model the outside subdomain. These two kinds of integral equations are coupled through the equivalent electric and magnetic currents that are placed on the interfaces. The key advantage of this proposed method is its ability to model both emission and susceptibility problems. This method can accurately simulate the impedance of the power-ground planes and the radiated field. In particular, it is able to predict the induced electric currents inside the power-ground planes that result from external interference sources. Therefore, this technique is able to provide a complete solution for the electromagnetic compatibility analysis of the system-level package.

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Investigation of relationship between ground bounce and common-mode radiation

Improved Eigenmode Expansion Method for Investigating of Ground Bounce in Power/ground Plane with Holes in PCBs

On the Evaluation of the Common-Mode Current along Twisted-Wire-Pairs

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Investigation on Circulation Current Calculation and Grounding Methods of Multi-circuit Cables

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PCB Electromagnetic Interference Modelling Based on Reciprocity Theorem

EMI and EMC Analysis of Arbitrarily Shaped Power-Ground Planes

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Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network

A Novel Imaging Method for the Impedance Calculation of Power and Ground Planes

Quantification of EMI for Power-Ground Plane and Novel EBG Structure for SSN Suppression

Efficient Signal And Power Integrity Analysis By Using Modal Decomposition And Integral Equations

Efficient Modeling of Rerouted Return Currents in Multilayered Power-Ground Planes by Using Integral Equation

Efficient Analysis of Radiated Immunity of Printed Circuit Boards Using SPICE

Novel Co-Simulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias

Calculation of Cable SGEMP Response for PCB Trace Based on Finite Element Method

Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

PI-EMI co-analysis of ground via effect

Numerical Characterization And Evaluation Of Esd Induced Field And Coupling On Interconnection Cable