A Novel Imaging Method for the Impedance Calculation of Power and Ground Planes

De-Cao Yang,Xing-Chang Wei,Li Er-Ping

DOI: https://doi.org/10.1109/isemc.2011.6038433

2011-01-01

Abstract:Power and ground planes are the major noise sources in the electronic package and multi-layered printed circuit boards. We propose a novel imaging method to simulate the impedance of power and ground planes. In the proposed method, the noise propagation between the power and ground planes is equivalent to a two-dimensional transverse magnetic problem. The electromagnetic wave multi reflections from the periphery of the power and ground planes are represented by the images of the source current, then a two-dimensional Green's function is used to efficiently calculate the contributions from the source and all its images. The major advantage of the proposed imaging method over the available mode expansion method is that it converges quickly at high frequencies, and it can be easily extended to simulate power and ground planes with arbitrary shapes. By the comparison with the full-wave method and measurement results, the accuracy and efficiency of the proposed imaging method are validated.