Reliability issues of lead-free solder joints in electronic devices
Nan Jiang,Liang Zhang,Zhi-Quan Liu,Lei Sun,Wei-Min Long,Peng He,Ming-Yue Xiong,Meng Zhao
DOI: https://doi.org/10.1080/14686996.2019.1640072
IF: 7.821
2019-09-02
Science and Technology of Advanced Materials
Abstract:<span>Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.<b>Graphical </b>Reproduced by permission from Zhang et al., J Mech Eng. 2012;48(24):56–60.Reproduced by permission from Zhang et al., J Mech Eng. 2012;48(24):56–60.</span>
materials science, multidisciplinary