Abstract:In current practice, DRAM manufacturers apply redundancy repair to decommission all the weak cells that cannot satisfy the target data retention time under the worse-case operational conditions (e.g., the highest operating temperature). However, as the DRAM scaling enters sub-20nm regime, it becomes increasingly challenging to repair all the weak cells at reasonable cost. This work studies how one could use DRAM chips with unrepaired weak cells in computing systems. In particular, this work is based upon the simple idea that OS reserves all the error-prone pages, which contain at least one unrepaired weak cell, from being used. Under a relatively high error-prone page rate (e.g., 8%), this basic idea is subject to two issues: (1) Simply reserving all the error prone pages could make it almost impossible for OS to allocate a continuous fragmentation-free physical memory space for some critical operations such as OS booting and DMA buffering. (2) Since most error-prone pages may only contain few unrepaired weak cells, reserving all the error-prone pages from practical usage could cause noticeable memory resource waste. Aiming to address these issues, this paper presents a controller-based selective page re-mapping strategy to ensure a continuous critical memory region for OS, and develops a software-based memory error tolerance scheme to re-cycle all the error-prone pages for the zRAM function in Linux. Since the first scheme only eliminates the fragmentation in the critical memory region (e.g., 128MB in Linux), the remaining non-critical memory region is still subject to severe fragmentation. Hence, we carried out experiments using SPEC CPU2006 to quantitatively demonstrate that highly fragmented non-critical memory region may not cause significant computing system performance degradation. We further study the latency and hardware cost of implementing the controller-based page re-mapping, and the effectiveness of re-cycling error-prone pages for zRAM in Linux. The experimental results show that our proposed software-based error tolerance scheme degrades the speed performance of zRAM by only up to 7%.

Logic-DRAM co-design to efficiently repair stacked DRAM with unused spares

Logic-DRAM Co-Design to Exploit the Efficient Repair Technique for Stacked DRAM

Improving 3D DRAM Fault Tolerance Through Weak Cell Aware Error Correction.

Architecture design exploration of three-dimensional (3D) integrated DRAM

A 3D Stackable 1T1C DRAM: Architecture, Process Integration and Circuit Simulation

A BISR Scheme for 3D Stacked Memory by Sharing Adjacent Redundancy Cells Across Dies

Yield Enhancement for 3D-Stacked Memory by Redundancy Sharing Across Dies

Design of 3D DRAM and Its Application in 3D Integrated Multi-Core Computing Systems

A Customized Design Of Dram Controller For On-Chip 3d Dram Stacking

A Cross-Process Signal Integrity Analysis (CPSIA) Method and Design Optimization for Wafer-on-Wafer Stacked DRAM

A Low-Cost Reduced-Latency DRAM Architecture With Dynamic Reconfiguration of Row Decoder

A Stacked Embedded DRAM Array for LPDDR4/4X Using Hybrid Bonding 3D Integration with 34gb/s/1gb 0.88pj/b Logic-to-Memory Interface

A Logic-Based Embedded Dram With Novel Cell Structure And Dynamically Adaptive Refresh For Long Data Retention, Zero Data Availability Penalty And High Yield

A Stacking Scheme Using Adjacent Redundancy Across Dies for 3D-stacked Memory

Yield Optimization Technique for Three Dimensional Memory Based on Redundancy Sharing Among Adjacent Layers

On the Use of Dram with Unrepaired Weak Cells in Computing Systems

Distributed memory interface synthesis for network-on-chips with 3D-stacked DRAMs

A 3D SoC Design for H.264 Application with On-Chip DRAM Stacking

3D DRAM Design and Application to 3D Multicore Systems.

A Die Selection and Matching Method for Yield Enhancement of 3D-Stacked Memories

Modeling and Analyzing of 3D DRAM as L3 Cache Based on DRAMSim2.