Preparation and Characterization of Epoxy Resin Modified with Alkoxysilane‐ Functionalized Poly(urethane‐imide) by the Sol–gel Process

Jiangxuan Song,Guangxin Chen,Yun Ding,Jianjun Shi,Ying Liu,Qifang Li
DOI: https://doi.org/10.1002/pi.3120
IF: 3.213
2011-01-01
Polymer International
Abstract:The sol-gel process has been frequently employed for preparation of high performance silica/polymer composites. In this paper, novel sol-gel precursor triethoxysilane-terminated poly(urethane-imide) (PUI-Si), combining the advantages of polyurethane (PU) and polyimide, was synthesized and characterized. Then PUI-Si was incorporated into the epoxy resin matrix to prepare a series of EP/PUI-Si organic-inorganic hybrids through an in situ sol-gel process and crosslinking reactions. The thermal stability of EP/PUI-Si hybrids was evaluated by thermogravimetric analysis and the results show that the PUI-Si could significantly improve the thermal properties of epoxy resin. The initial decomposition temperature of composites with 50 wt% PUI-Si reached 347.1 degrees C, 157.3 degrees C higher than that of neat epoxy resin. Furthermore, the tensile strength and breaking elongation can also be clearly improved by adding a suitable amount of PUI-Si. Similarly, the water contact angle increased to 97.4 degrees with 70 wt% PUI-Si, showing a hydrophobic surface. The morphology was investigated by transmission electron microscopy and the results reveal that the silica particles are smaller than 20 nm and have a strong interaction with the epoxy resin matrix, resulting in the above-mentioned high performance properties. (C) 2011 Society of Chemical Industry
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