Abstract:The existing research about ductile grinding of fused silica glass was mainly focused on how to carry out ductile regime material removal for generating very "smoothed" surface and investigate the machining-induced damage in the grinding in order to reduce or eliminate the subsurface damage.The brittle/ductile transition behavior of optical glass materials and the wear of diamond wheel are the most important factors for ductile grinding of optical glass.In this paper,the critical brittle/ductile depth,the influence factors on brittle/ductile transition behavior,the wear of diamond grits in diamond grinding of ultra pure fused silica（UPFS） are investigated by means of micro/nano indentation technique,as well as single grit diamond grinding on an ultra-stiff machine tool,Tetraform "C".The single grit grinding processes are in-process monitored using acoustic emission（AE） and force dynamometer simultaneously.The wear of diamond grits,morphology and subsurface integrity of the machined groves are examined with atomic force microscope（AFM） and scanning electron microscope（SEM）.The critical brittle/ductile depth of more than 0.5 μm is achieved.When compared to the using roof-like grits,by using pyramidal diamonds leads to higher critical depths of scratch with identical grinding parameters.However,the influence of grit shapes on the critical depth is not significant as supposed.The grinding force increased linearly with depth of cut in the ductile removal regime,but in brittle removal regime,there are large fluctuations instead of forces increase.The SEM photographs of the cross-section profile show that the median cracks dominate the crack patterns beneath the single grooves.Furthermore,The SEM photographs show multi worn patterns of diamond grits,indicating an inhomogeneous wear mechanism of diamond grits in grinding of fused silica with diamond grinding wheels.The proposed research provides the basal technical theory for improving the ultra-precision grinding of UPFS.

Single Grit Scratching and Diamond Grinding on Optical Glasses

Deformation Analysis of Micro/nano Indentation and Diamond Grinding on Optical Glasses

Surface and Subsurface Integrity in Diamond Grinding of Optical Glasses on Tetraform ‘C’

Ultraprecision finishing process integrated ELID grinding and MRF for BK glass

Single Grit Diamond Grinding of Spectrosil 2000 Glass on Tetraform 'C'

Prediction and Verification Analysis of Grinding Force in the Single Grain Grinding Process of Fused Silica Glass

Investigation of Surface and Subsurface Damage in Diamond Grinding of Optical Glass Using Hybrid Copper-Resin-Bonded Diamond Wheel

Grinding damage of BK7 using copper-resin bond coarse-grained diamond wheel

Investigation of Surface Integrity Induced by Ultra-Precision Grinding and Scratching of Glassy Carbon

Micro/Nano Indentation and Single Grit Diamond Grinding Mechanism on Ultra Pure Fused Silica

Surface and Sub-Surface Integrity of Ultra-Machined Bk7 Using Fine and Coarse Grained Diamond Wheels

Relationship Between Surface Roughness and Subsurface Crack Depth During Grinding of Optical Glass BK7

Material removal of optical glass BK7 during single and double scratch tests

Subsurface Damage Mechanisms In Diamond Grinding Of Bk7 On Tetraform 'C'

Investigation of grinding modes in horizontal surface grinding of optical glass BK7

Ultraprecision Ductile Grinding of Optical Glass Using Super Abrasive Diamond Wheel

ELID Assisted Grinding of Optical Glass with Fine and Coarse Grained Copper-Resin Bonded Diamond Wheels

Preparation of surface micro-structured coarse-grained diamond wheels based on high efficiency mechanical conditioning and picosecond pulsed laser machining

ELID Assisted Precision Conditioning of Coarse-Grained Diamond Grinding Wheel

Subsurface damage evaluation in the single abrasive scratching of BK7 glass by considering coupling effect of strain rate and temperature

Study on the material removal mechanism and the exit breakage of ultrasonic vibration-assisted grinding for microcrystalline glass