Phase Equilibria of the Cu–Ni–Si System at 700°C

Weihua Sun,Honghui Xu,Shuhong Liu,Yong Du,Zhaohui Yuan,Baiyun Huang
DOI: https://doi.org/10.1016/j.jallcom.2011.07.106
2011-01-01
ChemInform
Abstract:The phase equilibria at the isothermal section of the Cu-Ni-Si system at 700 degrees C were experimentally investigated. Thirty Cu-Ni-Si alloys were prepared by arc melting and annealed at 700 degrees C for 30 or 80 days, and examined with optical microscopy, X-ray diffraction, scanning electron microscopy with energy dispersive X-ray spectroscopy and electron probe microanalysis. Twelve three-phase regions were determined. The existence of the ternary compound tau(1)-Cu(56.8-63)Ni(10.4-16.1)Si(26.6-27.3) reported in literature was confirmed and a new compound tau(2)-Cu(45.8)Ni(25)Si(29.2) with nearly no homogeneity range was observed. The theta-Ni(2)Si compound, which exists above 820 degrees C in the binary Ni-Si system, was found to be stable at 700 degrees C and the composition range of Cu is 12.7-20.6 at.% Cu. The ternary solubilities of binary compounds were measured and noticeably the Cu(56)Si(11) compound can dissolve Ni up to 21.9 at.%. (C) 2011 Elsevier B.V. All rights reserved.
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