Piezoelectric Mems Generator Based on the Bulk Pzt/Silicon Wafer Bonding Technique

Gang Tang,Jing-quan Liu,He-sheng Liu,Yi-gui Li,Chun-sheng Yang,Dan-nong He,Viet DzungDao,Katsuhiko Tanaka,Susumu Sugiyama
DOI: https://doi.org/10.1002/pssa.201127186
2011-01-01
Abstract:A MEMS-based piezoelectric energy harvester was fabricated by bonding a piezoelectric ceramic Pb (Zr,Ti)O3 (PZT) plate to silicon wafer. The generator structure of a trapezoidal shape composite cantilever beam with nickel metal mass was designed. The novel fabrication techniques to obtain PZT thick film with excellent piezoelectric properties, including a low-temperature PZTSi bonding using epoxy resin as the intermediate adhesive layer and thinning of the bulk PZT ceramics by mechanical lapping and polishing method, were carried out. A piezoelectric MEMS power generator array was successfully fabricated and the measurement results for a microgenerator with typical dimension were also presented. The test result shows that this novel technique has great potential to fabricate high-performance piezoelectric MEMS energy harvester.
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