Undulation structure of InSb buffer layer and its effect on electrical properties of InSb/GaAs epilayer

Min Xiong,Meicheng Li
DOI: https://doi.org/10.3969/j.issn.1007-2276.2011.03.020
2011-01-01
Abstract:InSb epilayers on GaAs(001) substrates with different thicknesses of InSb buffer layers were grown by two-step method using molecular beam epitaxy(MBE). The Mullins' diffusion equation based on the continuum model was employed to investigate the evolution of the undulating surface during the initial stage of the InSb epilayer growth. Combined with the calculation results, the effects of undulation structure of InSb buffer layer on the following growth of InSb epilayer were illustrated by means of the atomic force microscope(AFM) data and the transmission electron microscopy(TEM). The results show that the InSb buffer layer with appropriate thickness could facilitate the InSb homoepitaxial growth, whereas InSb buffer layer beyond about 60 nm would increase the surface roughness and induce a lot of dislocations, which degrade the electrical properties of InSb epilayer. The InSb buffer layer with thickness of 30-50 nm grown by two-step method is suitable for high quality devices.
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