Design and Test of Capacitive Micromachined Ultrasonic Transducer
Hongliang Wang,Xiangjun Wang,Changde He,Chenyang Xue,Jijun Xiong,Wendong Zhang,Jing Miao,Yuping Li
2014-01-01
Abstract:Currently, most capacitive micromachined ultrasound transducers, adopting surface sacrificial technology encounter various problems such as difficult cavity etch, low controllability of membrane thickness etc., and their operating frequencies are more concentrated in several MHz bandwidths that cannot meet the requirements of long-distance imaging applications. In order to solve these problems, this paper proposes a new capacitive ultrasound transducer based on Si-Si bonding technology, which consists of an integration vibration membrane requiring no extra separate metal film and having high sensitivity, uniform thickness and more controllable frequencies. This transducer has several great advantages such as: easy processing, simple structure and process technology, and a high degree of integration. The structure and size of the transducer is determined by theoretical analysis and finite element analysis software ANSYS, and a process flow is also presented. Through scanning by SEM and Polytec MSA-400, the processed transducer is tested and analyzed, and the results are consonant with the simulation, verifying the reliability of the design and fabrication. Copyright © 2014 IFSA Publishing, S. L.