Thermal Conductivity, Electrical Resistivity, and Microstructure of Cu/W Multilayered Nanofilms
Lan Dong,Guo Wei,Tao Cheng,Jun Tang,Xiaobin Ye,Mengqing Hong,Lulu Hu,Ran Yin,Shuqin Zhao,Guangxu Cai,Yin Shi,Bicai Pan,Changzhong Jiang,Feng Ren
DOI: https://doi.org/10.1021/acsami.9b21182
IF: 9.5
2020-01-01
ACS Applied Materials & Interfaces
Abstract:Metallic multilayered nanofilms have been extensively studied owing to their unique physical properties and applications. However, studies on the thermal conductivity and electrical resistivity of metallic multilayered nanofilms, as their important physical properties, are seldom reported. In this work, Cu/W multilayered nanofilms with periodic thickness varying from 6 to 150 nm were deposited by magnetron sputtering. The resistivities of the Cu/W multilayered nanofilms increase with the decrease of periodic thickness, especially when the periodic thickness is smaller than 37 nm. The resistivities of the multilayered nanofilms fit well with the Fuchs-Sondheimer and Mayadas-Shatzkes (FS-MS) model, which considers both interface scattering and grain boundary scattering. The thermal conductivities of the Cu/W multilayered nanofilms were measured by the three-omega (3ω) method, which decrease with a decrease of periodic thickness initially and increase at the smallest periodic thickness of 6 nm. The Boltzmann transport equation (BTE)-based model was used, to explain the periodic thickness-dependent thermal conductivity of metallic multilayered nanofilms by considering the contributions from both phonon and electron heat transport processes, where the calculated thermal conductivities agree well with the measured ones. The electrical resistivity and thermal conductivity strongly depend on the microstructures of the multilayered nanofilms.