Abstract:Organic thin film blends of P3HT semiconducting polymers and PCBM fullerenes have enabled large‐scale semiconductor fabrication pertaining to flexible and stretchable electronics. However, molecular packing and film morphologies can significantly alter mechanical stability and failure behavior. To further understand and identify the fundamental mechanisms affecting failure, a multiphase microstructurally based formulation and nonlinear finite‐element fracture methodology were used to investigate the heterogeneous deformation and failure modes of organic semicrystalline thin film blends. The multiphase formulation accounts for the crystalline and amorphous behavior, polymer tie‐chains, and the PCBM aggregates. Face‐on packing orientations resulted in extensive inelastic deformation and crystalline rotation, and this was characterized by ductile failure modes and interfacial delamination. For edge‐on packing orientations, brittle failure modes and film cracking were due to lower inelastic deformation and higher film stress in comparison with the face‐on orientations. The higher crystallinity of P3HT and larger PCBM aggregates associated with larger domain sizes, strengthened the film and resulted in extensive film cracking. These predictions of ductile and brittle failure are consistent with experimental observations for P3HT:PCBM films. The proposed predictive framework can be used to improve organic film ductility and strength through the control of molecular packing orientations and microstructural mechanisms. © 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2016, 54, 896–907 To understand and predict the fundamental mechanisms affecting failure, a multiphase, microstructurally based formulation and nonlinear finite‐element fracture methodology are used to investigate the heterogeneous deformation and failure modes of organic semicrystalline thin film blends. This study provides fundamental understanding of local failure mechanisms and demonstrates the possible mechanical degradation due to physical morphological changes. Additionally, the proposed predictive framework can be used to improve film ductility and strength for failure‐resistant flexible electronics applications.

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