Abstract:High velocity impact between crystalline surfaces is important for a range of material phenomena, yet a fundamental understanding of the effect of surface structure, energetics and kinetics on the underlying thermo-mechanical response remains elusive. Here, we employ non-equilibrium molecular dynamics (NEMD) simulations to describe the nanoscale dynamics of the high velocity impact between commensurate and incommensurate monocrystalline (001) copper surfaces. For impact velocities in the range 100-1200 m/s, the kinetic energy dissipation involves nucleation and emission of dislocation loops from defective sites within the rapidly forming interface, well below the bulk single-crystal yield point. At higher velocities, adiabatic dissipation occurs via plasticity-induced heating as the interface structurally melts following the impact. The adhesive strength of the reformed interface is controlled by the formation and nucleation of dislocations and point defects as they modify the interfacial energy relative to the deformed bulk. As confirmation, the excess interface energy decreases monotonically with increasing impact velocity. The relative crystal orientation of the surfaces equally important; the grain boundaries formed following incommensurate impact exhibit higher impact resistance, with smaller defect densities and interfacial enthalpies, suggesting an enhanced ability of the grain boundaries to absorb the non-equilibrium damage and therefore facilitate particle bonding. Our study highlights the key role played by the atomic-scale surface structure in determining the impact resistance and adhesion of crystalline surfaces.

Nanoscale interface of metals for withstanding momentary shocks of compression.

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Atomistic Numerical Investigation of Single-crystal Copper Nanowire with Surface Defects

Role of Interfacial Transition Zones in the Fracture of Cu/V Nanolamellar Multilayers

Comprehensive Atomistic Modeling of Copper Nanowires-Based Surface Connectors

Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation

Interface-mediated thermomechanical effects during high velocity impact between monocrystalline surfaces

Influence of interface on deformation compatibility of a heterogeneous Cu/Al nanoscale multilayer

Development of Multi-Scale Computation Framework to Investigate the Failure Behavior of the Materials

Fracture Behavior of Functionally Graded Joint Interfaces Between Copper and Aluminum at Nano-Scale

Influence of Defects During the Tensile Deformation of Cu–Al Joint Interfaces at the Nano Scale

Fatigue-induced interface damage in Cu/V nanoscale metallic multilayers

Anisotropic Deformation in the Compressions of Single Crystalline Copper Nanoparticles

The Interface And Surface Effects Of The Bicrystal Nanowires On Their Mechanical Behaviors Under Uniaxial Stretching

Shock-induced Breaking of the Nanowire with the Dependence of Crystallographic Orientation and Strain Rate

Molecular dynamics simulation on spallation of [111] Cu/Ni nano-multilayers: Voids evolution under different shock pulse duration

On the Evolution of Nano-Structures at the Al–Cu Interface and the Influence of Annealing Temperature on the Interfacial Strength

Molecular dynamics simulation of the mechanical behavior of bi-crystal interfaces

Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste Near Room Temperature

Nanostructure, Plastic Deformation, and Influence of Strain Rate Concerning Ni/Al2O3 Interface System Using a Molecular Dynamic Study (LAMMPS)