Study on microstructure and thermophysical properties of 3D-Si/LG5 composites

Ziyang Xiu,Guoqin Chen,Xiaofeng Wang,Gaohui Wu,Zongquan Deng
2010-01-01
Rare Metal Materials and Engineering
Abstract:Dense and uniform Si-p/LG5 composites were fabricated by squeeze casting process, and then were treated by high temperature diffusion. Microstructure observation indicated that Si transformed from irregular sharp-particles to 3D network structure after high temperature diffusion treatment. Si-Al interface of 3D-Si-p/LG5 composites is smoother and has better bonding degree, compared with the interface of the untreated composites. There are Si precipitation in the interface and the matrix of 3D-Si-p/LG5 composites. Twin crystals were observed in the matrix of 3D-Si-p/LG5 composites. The average linear thermal expansion (CTE) of the composites is decreased by 10.5% after high temperature diffusion treatment. However, the thermal conductivity of 3D-Si-p/LG5 composites does not change significantly due to the decreased Si precipitation in the interface and matrix by 3D network structure of Si.
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