Effect of Annealing Temperature on Microstructure and Mechanical Properties of Cu/Mo/Cu Laminates

Wang Sha,Wang Kuaishe,Z. Bing,Guo Wei
DOI: https://doi.org/10.3969/j.issn.0258-7076.2010.03.025
2010-01-01
Abstract:The single-pass composite rolling was conducted on the Cu/Mo/Cu laminates. The effect of the annealing temperature on the microstructure and mechanical properties of the laminates was studied. The results showed that the annealing temperature had a significant effect on the microstructure of the copper plates. The fine grains distributed at the interface were more uniform with the increase of the annealing temperature. When the annealing temperature was up to 400°C, the microstructure of the copper was coarse due to recrystallization. With the annealing temperature increase, the bond strength of the composite plate gradually increased, and peaked at 400°C, to the value of 76 MPa. If the temperature continued to rise, the bond strength decreased rapidly. The main bond mechanism was crack bond.
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