Microstructure Evolution of Si3N4/Si3N4 Joint Brazed with Ag–Cu–Ti + SiCp Composite Filler

J. Zhang,Y. M. He,Y. Sun,C. F. Liu

DOI: https://doi.org/10.1016/j.ceramint.2010.02.010

IF: 5.532

2010-01-01

Ceramics International

Abstract:The Si3N4 ceramic was brazed by Ag–Cu–Ti+SiCp composite filler (p=particle) prepared by mechanical mixing. Effects of the content of Ti and SiC particles on microstructure of the joint were investigated. A reliable Si3N4/Si3N4 joint was achieved by using Ag–Cu–Ti+SiCp composite filler at 1173K for 10min. A continuous and compact reaction layer, with a suitable thickness, forms at the Si3N4/braze interface. The SiC particles react with Ti in the brazing layers, forming Ti3SiC2 thin layers around the SiC particles themselves and Ti5Si3 small particles in the Ag[Cu] and Cu[Ag] based solid solution. The higher content of SiC particles in the filler (≥10vol%) depresses interfacial bonding strength between the Si3N4 substrate and composite brazing layer due to the thinner reaction layer and the bad fluidity of the filler. The Ti3SiC2→TiC+Ti5Si3 reaction occurs when Ti concentration around SiC particles in the filler increases.