Abstract:Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni–Cu UBM is affected by the formation of intermetallic compounds (IMCs), specifically Ni3Sn4 and (Ni,Cu)3Sn4. This paper investigates the mechanical properties of IMCs, which are critical in assessing the longevity of solder joints. First-principles calculations were carried out to investigate the phase stability, mechanical properties and electronic structures of Ni3Sn4, Ni2.5Cu0.5Sn4, Ni2.0Cu1.0Sn4, and Ni1.5Cu1.5Sn4 IMCs. The calculated formation enthalpies show that the doping of Cu atoms leads to a decrease in the stability of the phases and a reduction in the mechanical properties of the Ni3Sn4 crystal structure. As the concentration of Cu atoms in the Ni3Sn4 cells increases, the bulk modulus values of (Ni,Cu)3Sn4 formed with different compositions decrease from 107.78 GPa to 87.84 GPa, the shear modulus decreases from 56.64 GPa to 45.08 GPa, and the elastic modulus decreases from 144.59 GPa to 115.48 GPa, indicating that the doping of Cu atoms into the Ni3Sn4 cells may adversely affect their mechanical properties and increase the possibility of microcracking at the interface during actual service. The anisotropy of (Ni,Cu)3Sn4 is more significant than that of Ni3Sn4, with Ni2.0Cu1.0Sn4 showing the highest anisotropy. After evaluating the electronic structures, the metallic properties of Ni3Sn4 and the Ni2.5Cu0.5Sn4, Ni2.0Cu1.0Sn4, and Ni1.5Cu1.5Sn4 phases are revealed by electronic structure analysis. The total density of states (TDOS) for (Ni,Cu)3Sn4 structures is mainly influenced by Ni-d and Cu-d states. The addition of Cu atoms can increase the brittleness of Ni3Sn4. In addition, the region where d and p hybridisation occurs gradually increases with increasing Cu content. The electronic properties suggest that the binding energy between Ni and Sn atoms weakens with the addition of Cu atoms, resulting in a decrease in the elastic modulus. This research can serve as a valuable reference and theoretical guide for future applications of these materials.

First-Principles calculations of structural, thermodynamic and electronic properties of intermetallic compounds in solder

First-principles Investigation of the Structural and Electronic Properties of Cu6−xNixSn5 (x=0, 1, 2) Intermetallic Compounds

First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds

Effects of additive elements on structural and electronic properties of Sn-based intermetallics by first principles

First-Principles Calculations Of Zn Substitutions In Cu(6)Sn5

A first-principles study of the mechanical and physical properties of Ni 3 Sn x intermetallic compounds for high-temperature power device packaging

Temperature dependent mechanical properties of inter-metallic compounds in nano-solder joints

The Structural, Elastic And Thermodynamic Properties Of Intermetallic Phases In Mg-Sn-Si-Ca(Sr) Alloys: A First-Principles Study

First-principles Calculations of the Effects of Cu and Ag Additions on the Electromigration of Sn-based Solder

Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints

Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds

Effect of intermetallic on electromigration and atomic diffusion in Cu/SnAg 3.0Cu 0.5/Cu joints: Experimental and first-principles study

Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

First-principle and molecular dynamics calculations for physical properties of Ni–Sn alloy system

Mechanical Property Of Cu-Sn-Ni Intermetallics In The Full Intermetallic Micro-Joints Formed With Transient Liquid Phase Soldering

Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints

Effects of Soldering Temperature on IMCs Formation between Sn-0.7Cu Solder and Cu Substrate

Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint